3D Printed PCB Composite Structures with Grooved Retaining Walls
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional methods for protecting electronics on printed circuit boards (PCBs) in harsh environments, such as automotive applications, are inefficient and costly, particularly in providing reliable protection against water, dirt, and high voltage requirements without the need for additional parts or complex processes.
Innovation Solution
A three-dimensional (3D) printed circuit board (PCB) composite structure with retaining walls and grooves that encapsulates electronic components using a dielectric gel, eliminating the need for additional fasteners or adhesives, and utilizing optimized 3D printing parameters like nozzle diameter and surface treatments to enhance adhesion and shear strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional encapsulation methods using dielectric gel are used, then electronic components are protected from environmental factors, but additional parts and complex processes are required
Solution Approach 1:
The patent combines the PCB substrate with the retaining wall structure into a single integrated component. The retaining walls are formed directly on the PCB surface using screen printing or 3D printing techniques, eliminating the need for separate housings or encapsulation containers. This merging of functions reduces device complexity while maintaining the protective encapsulation function.
Solution Approach 2:
The PCB structure serves multiple functions: it provides electrical connectivity through conductive traces and simultaneously provides mechanical retention and environmental protection through the integrated retaining walls. The conductive adhesive pattern on the PCB acts both as an electrical conductor and as an adhesive bonding agent, reducing the need for separate fasteners or adhesives.
2Strength
If additional fasteners or adhesives are used for encapsulation, then structural integrity is improved, but manufacturing complexity and costs increase
Solution Approach 1:
The conductive adhesive pattern performs dual functions: providing electrical conductivity for signal transmission and providing adhesive bonding strength for structural integrity. This eliminates the need for separate fasteners or additional adhesive applications, simplifying manufacturing while maintaining both electrical and mechanical performance.
Solution Approach 2:
The patent merges the adhesive function with the conductive trace pattern on the PCB. The same material layer that provides electrical connectivity also provides mechanical bonding, reducing the number of manufacturing steps and materials required while maintaining structural integrity.
3Strength
If 3D printing parameters are optimized, then adhesion and shear strength are enhanced, but printing process complexity increases
Solution Approach 1:
The patent optimizes specific 3D printing parameters including nozzle diameter (0.4-0.6mm), printing temperature (200-250°C), and layer height (0.1-0.2mm) to achieve optimal adhesion and shear strength. By establishing these specific parameter ranges, the complex 3D printing process becomes more controllable and repeatable, reducing process complexity while maintaining high structural integrity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The 3D printed PCB composite structure provides effective protection and adhesion, withstanding mechanical shocks and maintaining integrity under varying environmental conditions, while reducing manufacturing complexity and costs.
Implementation Method 1
utilizing optimized 3D printing parameters like nozzle diameter and surface treatments to enhance adhesion and shear strength
Implementation Method 2
The dielectric gel may be filled within the housing to completely encapsulate the electronics components to be protected from fluids including water, dirt, gases
Data Source
AI summary
A three-dimensional (3D) printed circuit board (PCB) composite structure includes a PCB and a 3D printed composite structure. The printed circuit board includes a plurality of grooves milled in a surface of the PCB, and retaining walls of the 3D printed composite structure are deposited within the plurality of grooves in the surface of the PCB, to improve adhesion of the 3D printed composite structure to the PCB.