3D-Printed PUF Packaging for Multi-Layer Wireless Security

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Solution Overview

Problem

Existing methods for manufacturing physically unclonable functions (PUFs) are expensive and limited by conventional layer-to-layer manufacturing technologies, and they do not leverage the potential of 3D printing for introducing randomness and combining multiple PUFs in a single package.

Innovation Solution

The implementation of 3D printing to manufacture physically unclonable wireless systems (PUWS) introduces randomness and combines multiple PUFs, such as optical and via-based PUFs, within a single device structure, enabling flexible customization of PUF parameters and enhanced security measures.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If conventional layer to layer manufacturing technology is used to manufacture PUFs, then manufacturing precision can be maintained, but manufacturing cost increases and flexibility decreases

Engineering Contradiction:
ImprovePUF manufacturing precisionVSAvoidmanufacturing cost and flexibility
Core Design Contradiction:
Manufacturing precisionVSEase of manufacture

Solution Approach 1:

The patent replaces conventional mechanical layer-to-layer manufacturing processes with 3D printing technology. This substitution enables direct digital manufacturing of PUFs with randomized geometries, achieving both manufacturing precision and cost-effectiveness while improving flexibility and customization capabilities.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent changes the manufacturing approach from fixed conventional processes to 3D printing with randomized geometric parameters. By varying geometric parameters during the 3D printing process, the system achieves unique PUF characteristics for each device while maintaining manufacturing precision and reducing costs.

Inventive Principle:
Principle #35Parameter changes

2Reliability

If multiple PUFs are combined in a single package, then security and customization are enhanced, but device complexity increases

Engineering Contradiction:
Improvesecurity and customizationVSAvoiddevice structure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent merges multiple PUFs (optical PUF, via-based PUF, antenna PUF) into a single integrated package using 3D printing technology. This combining approach enhances security and customization while the additive manufacturing process actually simplifies the overall device structure compared to traditional multi-component assemblies.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The 3D printed package structure serves multiple functions simultaneously: it houses optical PUF elements, creates via-based PUF patterns, incorporates antenna structures, and provides mechanical support. This multi-functionality reduces the need for separate components and assembly steps, thereby reducing overall device complexity.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Adaptability or versatility

If 3D printing is used to introduce randomness into PUF manufacturing, then flexibility and cost-effectiveness improve, but manufacturing precision may be compromised

Engineering Contradiction:
Improveflexibility and cost-effectivenessVSAvoidPUF manufacturing precision
Core Design Contradiction:
Adaptability or versatilityVSManufacturing precision

Solution Approach 1:

The patent introduces controlled randomness and variability into the 3D printing process parameters, such as layer thickness, infill patterns, and geometric features. This dynamic approach creates unique PUF characteristics for each device while maintaining sufficient manufacturing precision through controlled parameter ranges and validation processes.

Inventive Principle:
Principle #15Dynamics

Data Source

PatentUS12225142B23D printed physically unclonable wireless systems (PUWS)
Publication Date: 2025.02.11 UNIV OF SOUTH FLORIDA
  • US12225142B2 patent drawing
  • US12225142B2 patent drawing
  • US12225142B2 patent drawing

AI summary

Three-dimensional (3D) printing is implemented to introduce randomness into systems and devices that are being manufactured. 3D printed physically unclonable wireless systems (PUWS) provide flexibility in system package complexity, number of physically unclonable function (PUF) based security measures/types, and customization of the PUF parameters. Using flexibility and economics of 3D printing, PUWS can combine multiple PUF measures in a 3D package for cryptographic secret keys and introduce PUFs at the physical layer of the communication system. A 3D printed wireless system packaging concept is described herein where 3D printing parameters are randomized to 1) generate new physically unclonable functions (at the physical layer), 2) generate new physically unclonable functions within the system package (rather than at integrated circuit (IC) level), and 3) combine multiple physically unclonable functions (such as optical and electrical/VIA based ones) within single device structure.