3D Printed Wiring Structure for Component Carrier Design
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Solution Overview
Problem
Conventional component carriers with wiring structures face challenges in achieving high accuracy and flexibility in design, particularly in the arrangement of wiring structures and electrical connections, which limits their precision and complexity.
Innovation Solution
A component carrier with a carrier body comprising electrically conductive and insulating layer structures, where the wiring structure is at least partially formed as a three-dimensionally printed structure, allowing for flexible geometry and precise formation of electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If conventional plating methods are used to form wiring structures, then manufacturing process is well-established, but design flexibility and arrangement flexibility of wiring structures are limited
Solution Approach 1:
The patent applies 3D printing technology to form wiring structures in three dimensions rather than traditional two-dimensional planar structures. This enables complex spatial arrangements, vertical interconnections, and non-planar routing that were not feasible with conventional plating methods, directly resolving the contradiction between arrangement flexibility and manufacturing complexity
Solution Approach 2:
The patent replaces the electrochemical plating process with additive manufacturing (3D printing) technology. This substitution enables direct deposition of conductive materials according to digital models, providing design freedom without the constraints of traditional plating geometry and significantly improving arrangement flexibility while maintaining manufacturing feasibility
2Manufacturing precision
If conventional plating methods are used to form wiring structures, then manufacturing process is simple, but formation accuracy and shape precision are limited
Solution Approach 1:
The patent employs digital modeling and simulation before actual manufacturing. The wiring structure is first designed in 3D space with precise geometric parameters, then fabricated layer-by-layer according to the digital model. This preliminary digital preparation ensures high shape accuracy and formation precision while managing process complexity through computational planning
Solution Approach 2:
The patent utilizes controllable parameters of 3D printing technology such as layer thickness, deposition rate, and material composition to achieve high manufacturing precision. By optimizing these parameters, the system can produce wiring structures with precise dimensions and geometries that exceed the capabilities of conventional plating methods
3Reliability
If complex wiring structures are designed for high precision connections, then connection quality improves, but manufacturing difficulty and process complexity increase
Solution Approach 1:
The patent leverages three-dimensional printing capability to create complex wiring structures that provide multiple connection paths and spatial routing options. This dimensional freedom enables high-reliability connections through redundant pathways and optimized signal routes without proportionally increasing manufacturing difficulty, as the 3D printing process naturally accommodates complex geometries
Data Source
Figure 1~7
Figure 8a~11
AI summary
A component carrier and a method for manufacturing a component carrier is described wherein the component carrier comprises a carrier body which comprises a plurality of electrically conductive layer structures and/or electrically insulating layer structures and a wiring structure on and/or in the layer structures wherein the wiring structure being at least partially formed as a three-dimensionally printed structure.