3D Semiconductor Device Warpage Reduction via Segmented Substrate
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Solution Overview
Problem
There is a growing demand for improving the price competitiveness of semiconductor devices by increasing their degree of integration, which existing technologies have not adequately addressed.
Innovation Solution
A three-dimensional semiconductor device is designed with a first substrate, a second substrate featuring pattern portions and a plate portion, a lower structure, and horizontal conductive patterns stacked on the second substrate, where the plate portion has a greater width than the pattern portions and is connected to them, enhancing integration and preventing warpage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the degree of integration is increased to improve price competitiveness, then productivity and integration are improved, but warpage occurs in the semiconductor device
Solution Approach 1:
The semiconductor device is divided into multiple substrates (first substrate, second substrate, third substrate) with distinct functional regions. The second substrate is further segmented into pattern portions and a plate portion, allowing differential stress management and preventing warpage while maintaining high integration.
Solution Approach 2:
The plate portion of the second substrate is designed with asymmetric dimensions (width greater than length) and is positioned to extend beyond the pattern portions. This asymmetric configuration provides structural support to counteract warpage forces generated by the integrated three-dimensional structures.
2Productivity
If multiple substrates are stacked to improve integration, then the degree of integration is improved, but manufacturing complexity increases
Solution Approach 1:
The device is segmented into multiple independently manufacturable substrates that can be processed separately and then stacked. Each substrate can be fabricated using standard CMOS processes, reducing overall manufacturing complexity while achieving high integration through vertical stacking.
Solution Approach 2:
The second substrate serves multiple functions: it provides mechanical support through the plate portion, carries active circuit elements through the pattern portions, and enables electrical connections between the first and third substrates. This multi-functionality reduces the need for additional specialized components.
Data Source
AI summary
A three-dimensional semiconductor device includes a first substrate, a second substrate on the first substrate, the second substrate including pattern portions and a plate portion covering the pattern portions, the plate portion having a width greater than a width of each of the pattern portions and being connected to the pattern portions, a lower structure between the first substrate and the second substrate, horizontal conductive patterns on the second substrate, the horizontal conductive patterns being stacked while being spaced apart from each other in a direction perpendicular to an upper surface of the second substrate, and a vertical structure on the second substrate and having a side surface opposing the horizontal conductive patterns.