3D Silicon Capacitor Structure With Single-Step Electrode Patterning
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Solution Overview
Problem
The manufacturing of 3D silicon capacitors requires multiple photolithography steps, leading to higher pattern alignment accuracy and cost due to the need for extensive photolithography processes, which complicates the process and increases expenses.
Innovation Solution
A capacitor design and manufacturing method that reduces photolithography steps by creating a second conductive layer with independent regions, allowing both electrodes to be formed through a single photolithography process, thereby simplifying the process and reducing alignment difficulties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If multiple photolithography steps are performed to manufacture 3D silicon capacitors, then the capacitance density can be increased, but the pattern alignment accuracy requirement and manufacturing cost increase
Solution Approach 1:
The patent merges the formation of two independent conductive regions into a single photolithography step. The second conductive layer is designed with a specific structure that allows both conductive regions to be formed simultaneously through one exposure and development process, eliminating the need for multiple separate photolithography steps and their associated alignment requirements.
Solution Approach 2:
The second conductive layer serves multiple functions: it forms both the first and second conductive regions that are electrically independent, while being created through a single photolithography process. This multi-functional design reduces the number of processing steps while maintaining the required electrical isolation and connectivity.
2Manufacturing precision
If multiple photolithography steps are performed to manufacture 3D silicon capacitors, then the capacitance structure can be completed, but the manufacturing cost increases
Solution Approach 1:
The patent combines multiple photolithography operations into a single step by designing the second conductive layer to contain both conductive regions. This reduction in the number of photolithography cycles directly lowers manufacturing costs by reducing material consumption, equipment usage time, and process complexity.
Solution Approach 2:
The second conductive layer is designed to self-define both conductive regions through its structural configuration. The layer includes a first conductive region electrically connected to the semiconductor substrate and a second conductive region electrically connected to the first conductive layer, with both regions formed in one photolithography step, making the process more self-contained and efficient.
3Ease of operation
If multiple photolithography steps are performed, then the capacitor electrodes can be formed separately, but the process complexity and alignment difficulty increase
Solution Approach 1:
The patent merges the formation of multiple electrodes into a single photolithography step. The second conductive layer is structured to provide both conductive regions with their respective electrical connections in one process, reducing process complexity while maintaining the ability to form separate electrode structures.
Solution Approach 2:
The second conductive layer is segmented into two electrically independent regions: a first conductive region connected to the semiconductor substrate and a second conductive region connected to the first conductive layer. This segmentation allows each region to serve its specific electrical function while being formed through a unified photolithography process.
Data Source
AI summary
A capacitor includes: a semiconductor substrate; at least one trench provided in the semiconductor substrate and formed downward from an upper surface of the semiconductor substrate; a first conductive layer provided above the semiconductor substrate and in the trench; a first insulating layer provided between the substrate and the first conductive layer to isolate the first conductive layer from the substrate; a second conductive layer provided above the r substrate and in the trench, the second conductive layer including a first and a second conductive region that are independent from each other, the first conductive region being electrically connected to the substrate, and the second conductive region being electrically connected to the first conductive layer; and a second insulating layer provided between the first and the second conductive layer to isolate the first conductive region from the first conductive layer and isolate the second conductive region from the substrate.