3D Solenoid Inductor Structure for Compact High-Q Chip Integration
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The miniaturization of semiconductor chips requires inductors with a compact size and high electrical performance, while existing planar inductors face challenges in reducing physical size and fabrication cost without compromising electrical performance.
Innovation Solution
A semiconductor structure featuring a magnetic core with a closed ring pattern and a solenoid-shaped metal layer wound around it, forming a 3D inductor, which reduces surface area and improves quality factor and heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If planar inductor design is used, then fabrication process is simple, but physical size cannot be reduced further while maintaining performance
Solution Approach 1:
The patent transitions from a planar (2D) inductor design to a three-dimensional solenoid structure by winding the metal layer around a magnetic core in a spiral pattern. This dimensional change allows the inductor to achieve higher power density and improved electrical performance by utilizing vertical space and creating a compact volumetric structure rather than being constrained to a flat surface layout.
Solution Approach 2:
The patent embeds the metal solenoid winding within a magnetic core structure, creating a nested configuration where the metal layer is wound around the magnetic core. This nesting approach maximizes the use of available space, allows the metal and magnetic materials to work together synergistically, and achieves compact integration of multiple functional elements within a small volume.
2Volume of moving object
If inductor size is reduced for chip miniaturization, then integration density improves, but heat dissipation becomes more difficult
Solution Approach 1:
The patent applies different material properties to different regions of the inductor structure. The magnetic core provides magnetic permeability enhancement in the central region, while the metal solenoid winding provides conductivity and inductance. This local differentiation of material properties allows each region to optimize its function while working together to achieve compact size and effective heat management through controlled current distribution.
3Reliability
If 3D solenoid structure is implemented, then quality factor and power density improve, but fabrication complexity increases
Solution Approach 1:
The patent forms the magnetic core structure before winding the metal solenoid layer around it. This preliminary formation of the magnetic core provides a pre-defined template and support structure that guides the subsequent metal deposition process. By establishing the magnetic core first, the fabrication process benefits from a structured foundation that simplifies the complex task of creating the three-dimensional solenoid geometry.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The 3D solenoid inductor achieves compact size, high quality factor, and efficient heat dissipation, facilitating higher integration and efficiency in semiconductor structures.
Implementation Method 1
a magnetic core, wherein the magnetic core is located in the base, and an orthographic projection of the magnetic core on the first surface is a closed ring pattern
Implementation Method 2
a solenoid-shaped metal layer, wherein the metal layer is located in the base and the dielectric layer and is wound around the magnetic core
Data Source
AI summary
The present disclosure provides a semiconductor structure and a fabrication method thereof. The semiconductor structure includes: a base, wherein the base is provided with a first surface and a second surface that are opposite to each other; a magnetic core, wherein the magnetic core is located in the base, and an orthographic projection of the magnetic core on the first surface is a closed ring pattern; a dielectric layer, wherein the dielectric layer is located on the second surface; and a solenoid-shaped metal layer, wherein the metal layer is located in the base and the dielectric layer and is wound around the magnetic core; the metal layer is an integrated structure; the metal layer and the magnetic core are spaced apart from each other; part of the metal layer is exposed on the first surface.