3D-Printed Stack Components With Interposer Pin Layer Connection
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional methods for manufacturing stack components are labor-intensive, costly, and offer limited design flexibility and high-density stacking capabilities.
Innovation Solution
A method involving simultaneous 3D printing of circuit layers and interposers side by side, followed by mounting a circuit element and interposer, and inserting an interlayer connection pin to electrically connect the layers, allowing for efficient formation and diversification of circuit layers and interposers, and various stacking structures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional manufacturing methods using multiple printed circuit boards are used, then the stack component can be manufactured with established processes, but the productivity is poor and manufacturing cost is high due to labor-intensive steps
Solution Approach 1:
The patent merges the manufacturing of the circuit layer and interposer into a single 3D printing process, eliminating the need for separate manufacturing steps. The 3D printer simultaneously forms both components in one operation, significantly reducing labor intensity and improving productivity while maintaining ease of manufacture through automated printing processes
Solution Approach 2:
The patent replaces conventional mechanical assembly processes (cutting, stacking, manual insertion) with additive manufacturing technology. The 3D printer creates both the circuit layer and interposer with integrated connection pin holes, eliminating multiple mechanical operations and reducing manufacturing complexity
2Adaptability or versatility
If conventional manufacturing methods with printed circuit boards are used, then the process is well-established, but the degree of freedom in design is small and cannot meet demands for variety and high density
Solution Approach 1:
The patent enables dynamic design flexibility through 3D printing, allowing the circuit layer and interposer geometries to be easily modified by changing digital models. The additive manufacturing process can accommodate varying densities, patterns, and configurations without requiring new tooling or fixtures, meeting diverse design demands while managing structural complexity
Solution Approach 2:
The patent transitions from conventional 2D printed circuit board design to 3D additive manufacturing, enabling high-density stacking structures with vertical integration. The 3D printing process creates multi-layer configurations with connection pins extending through layers, achieving high density by utilizing the third dimension while maintaining design adaptability through digital modeling
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances productivity, reduces manufacturing costs, and facilitates diverse and high-density stacking configurations by efficiently forming circuit layers and interposers and enabling flexible stacking designs.
Implementation Method 1
a printing step of simultaneously printing and forming the circuit layer and the interposer side by side in a planar manner by a 3D printer
Data Source
AI summary
A method for manufacturing a stack component in which an interposer is interposed to form a space for inserting an interlayer connection pin between circuit layers to be stacked, the method includes a printing step of simultaneously printing and forming the circuit layer and the interposer side by side in a planar manner by a 3D printer, a step of mounting a circuit element on the circuit layer, a step of mounting the interposer on the circuit layer, a step of inserting the interlayer connection pin into the interposer mounted on the circuit layer, and a step of electrically connecting the circuit layer and another circuit layer by the interlayer connection pin by stacking the other circuit layer on the circuit layer via the interposer.