3D Stacked Die Package with Through-Hole Nesting
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing integrated device packaging technologies face challenges in minimizing both the footprint and height of packages on external device substrates, as stacking dies reduces footprint but increases package height, which can be undesirable in compact devices like mobile devices.
Innovation Solution
The solution involves creating a packaged integrated device with a first die having a through hole or recess, allowing a second die to be stacked and partially inserted, thereby reducing package height while maintaining a reduced footprint through innovative stacking configurations and electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If multiple integrated device dies are stacked on top of one another, then the package footprint on the external device substrate is reduced, but the package height increases
Solution Approach 1:
The patent applies nesting by having a portion of the second die extend into a through-hole of the first die, creating a nested configuration where one die is partially inserted into another. This reduces the overall package footprint while minimizing the increase in package height compared to conventional stacking where dies are placed directly on top of each other without interlocking.
Solution Approach 2:
The patent transitions from conventional two-dimensional side-by-side die placement to three-dimensional stacking with vertical integration. By utilizing the vertical dimension and creating a through-hole structure, the patent achieves compact packaging that reduces footprint while managing height through the nested configuration rather than simple vertical stacking.
2Length of stationary object
If multiple integrated device dies are placed side by side on a package substrate, then the package height is minimized, but the package footprint increases
Solution Approach 1:
The patent moves from two-dimensional side-by-side die placement to three-dimensional stacking by utilizing vertical space. The through-hole structure enables the second die to extend into the first die, effectively using the vertical dimension to reduce footprint while keeping the overall package height manageable through the nested configuration.
Solution Approach 2:
By implementing a nested configuration where the second die partially inserts into the first die through a through-hole, the patent achieves compact packaging that reduces footprint. This nested arrangement is more space-efficient than side-by-side placement, as it utilizes the volume of the first die rather than requiring additional lateral space.
3Area of stationary object
If a portion of one die extends into a hole of another die, then both package footprint and height are minimized, but manufacturing complexity increases
Solution Approach 1:
The patent applies segmentation by dividing the package structure into distinct segments: the first die with its through-hole, and the second die with the portion extending into the hole. This segmentation allows for modular manufacturing where each die can be fabricated separately and then assembled, reducing overall manufacturing complexity compared to creating a monolithic structure.
Solution Approach 2:
The through-hole in the first die is formed in advance during the fabrication process, before the second die is attached. This preliminary action simplifies the assembly process, as the hole is already prepared to receive the extending portion of the second die, rather than requiring complex post-assembly operations to create the nested configuration.
Data Source
AI summary
Packages and methods for 3D integration are disclosed. In various embodiments, a first integrated device die having a hole is attached to a package substrate. A second integrated device die can be stacked on top of the first integrated device die. At least a portion of the second integrated device die can extend into the hole of the first integrated device die. By stacking the two dies such that the portion of the second integrated device die extends into the hole, the overall package height can advantageously be reduced.