3D Substrate with Hollow Observation Ports for High-Density Mounting
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current electronic component mounting structures face challenges in increasing mounting density and effectively observing connection failures, which limits their efficiency and reliability.
Innovation Solution
A three-dimensional substrate with hollow portions on side surfaces and opening portions for observation, allowing electronic components to be mounted on the bottom face and enabling visual inspection of connection terminals and electrodes from the outside, thereby improving mounting density and detection of connection failures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If electronic components are mounted in hollow portions on side surfaces to increase mounting density, then mounting density is improved, but observation of connection portions becomes difficult
Solution Approach 1:
The side surface of the three-dimensional substrate is segmented into multiple regions: a hollow portion for mounting the electronic component and an opening portion for observation. This segmentation allows the connection portion to be accessible for inspection while maintaining the compact three-dimensional structure that enables high mounting density.
Solution Approach 2:
The opening portion acts as an intermediary channel that provides a viewing path from the outer periphery to the connection portion inside the hollow structure. This mediator enables visual inspection of connection failures without compromising the space-efficient mounting arrangement.
2Productivity
If three-dimensional substrate structure is used to increase mounting density, then productivity is improved, but structural complexity increases
Solution Approach 1:
The three-dimensional substrate serves multiple functions simultaneously: it provides mechanical support, enables high-density component mounting through its hollow portions, and facilitates inspection through opening portions. This multi-functionality increases productivity while managing structural complexity by consolidating multiple purposes into a single integrated structure.
Data Source
AI summary
An electronic component mounting structure includes a three-dimensional substrate having a three-dimensional shape and including a hollow portion formed on at least one of side surfaces of the three-dimensional substrate, and an electronic component mounted on a bottom face of the hollow portion. The three-dimensional substrate includes an opening portion on a side surface different from a side surface on which the hollow portion is formed for allowing observation of a connection portion between the bottom face of the hollow portion and the electronic component from an outer periphery side of the three-dimensional substrate.