3D Vapor Chamber Structure for Targeted Immersion Cooling

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Solution Overview

Problem

Conventional thermal management systems cool computing devices uniformly, which may inadequately cool high-capacity components and wastefully cool components that do not require thermal management.

Innovation Solution

A vapor chamber with a main body, vertical structures, and an enhanced boiling surface is thermally connected to heat-generating components, allowing for efficient heat transfer and boiling of the immersion working fluid.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If conventional thermal management systems cool the entire device uniformly, then all components are cooled, but high-capacity components are insufficiently cooled and energy is wasted on components that do not need thermal management

Engineering Contradiction:
Improvecomponent temperature controlVSAvoidenergy waste
Core Design Contradiction:
TemperatureVSLoss of energy

Solution Approach 1:

The vapor chamber incorporates vertical structures with enhanced boiling surfaces at specific locations to concentrate cooling capacity where heat-generating components are positioned. This localized enhancement allows targeted thermal management of high-capacity components while reducing cooling effort for other areas, thereby improving temperature control efficiency and reducing energy waste.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The patent introduces vertical structures extending from the main vapor chamber body, creating a three-dimensional cooling architecture. These vertical structures provide additional surface area and create channels that enhance fluid circulation and heat transfer in the vertical dimension, enabling more effective cooling of specific component regions without uniformly cooling the entire device.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Temperature

If conventional thermal management systems cool the entire device uniformly, then cooling coverage is comprehensive, but high-capacity components receive insufficient cooling

Engineering Contradiction:
Improvehigh-capacity component coolingVSAvoidcooling efficiency
Core Design Contradiction:
TemperatureVSProductivity

Solution Approach 1:

The vapor chamber features localized enhanced boiling surfaces on vertical structures positioned at specific locations corresponding to high-capacity heat-generating components. This concentrates the phase change heat transfer mechanism where it is most needed, improving cooling efficiency for critical components rather than distributing cooling capacity uniformly across the entire device.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The cooling system is segmented into distinct regions: the main vapor chamber body and additional vertical structures. This segmentation allows independent optimization of cooling capacity in different zones, with vertical structures providing enhanced cooling precisely where high-capacity components require it, thereby improving overall cooling efficiency.

Inventive Principle:
Principle #1Segmentation

3Temperature

If vertical structures are added to the vapor chamber to enhance cooling, then thermal management is improved, but device complexity increases

Engineering Contradiction:
Improvethermal management effectivenessVSAvoidvapor chamber structure
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

The vertical structures are integrated as part of the vapor chamber's internal architecture, merging the cooling enhancement features with the main chamber body. This integration approach improves thermal management effectiveness while avoiding the need for separate external cooling components, thereby limiting the increase in overall device complexity.

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration enhances thermal management by efficiently cooling high-capacity components while minimizing energy waste, effectively maintaining component temperatures within safe ranges.

Implementation Method 1

The vapor chamber is thermally connected to the heat-generating component to conduct thermal energy from the heat-generating component

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

The immersion working fluid contacts at least a portion of the vapor chamber

Methodology Applied
Scientific EffectConvection: Convection

Implementation Method 3

efficient heat transfer and boiling of the immersion working fluid

Methodology Applied
Scientific EffectPhase change: Phase Change

Implementation Method 4

an enhanced boiling surface located on at least a portion of the vertical structure

Methodology Applied
Scientific EffectBoiling: Boiling

Implementation Method 5

boiling of the immersion working fluid

Methodology Applied
Scientific EffectEvaporation: Evaporation

Implementation Method 6

The wicking structure is in the interior volume

Methodology Applied
Scientific EffectCapillary action: Capillary Action

Data Source

PatentUS12336143B2Systems and methods for three-dimensional vapor chambers in immersion-cooled datacenters
Publication Date: 2025.06.17 MICROSOFT TECHNOLOGY LICENSING LLC
  • US12336143B2 patent drawing
  • US12336143B2 patent drawing
  • US12336143B2 patent drawing

AI summary

A vapor chamber includes a main body, a first vertical structure, and an enhanced boiling surface. The main body has a first surface and defines a first portion of an interior volume. The first vertical structure protrudes transverse to the main body and defines a second portion of the interior volume. The enhanced boiling surface is on at least a portion of the first vertical structure.