3D Volumetric PCB Architecture for Compact EMI Shielding
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing printed circuit boards (PCBs) face limitations in miniaturization due to increased vertical height and reduced testability when attempting to reduce size, and current solutions compromise on system performance or feature availability.
Innovation Solution
A 3-D volumetric board architectural design that utilizes the unused vertical space by mounting components on two PCBs, with a shielded flexible PCB (FPC) electromagnetic interference (EMI) enclosure to relocate components and signal routings, maintaining testability and performance while reducing size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If the number of circuit board layers is increased to reduce circuit board size, then the circuit board footprint is reduced, but the vertical height increases and system performance is reduced
Solution Approach 1:
The patent transitions from a 2-D PCB layout to a 3-D volumetric architecture by folding a single flexible PCB into multiple spatial layers. This allows the circuit board to utilize vertical space without increasing overall device height, as the flexible PCB can be folded into compact configurations that maintain electrical connectivity while reducing footprint.
Solution Approach 2:
The patent employs a flexible PCB instead of rigid multi-layer boards. The flexible nature of the PCB allows it to be folded into complex 3-D configurations, enabling compact volumetric arrangements that reduce footprint without requiring additional vertical height or compromising electrical performance.
2Area of stationary object
If discrete components are embedded into the circuit board to reduce size, then the circuit board size is reduced, but access to components is reduced and testability is hindered
Solution Approach 1:
The patent segments the circuit board into multiple accessible regions by folding the flexible PCB into a 3-D configuration. This segmentation allows different functional areas to be positioned on different faces or levels of the folded structure, maintaining accessibility to components for testing and repair while achieving compact overall size.
Solution Approach 2:
By transitioning from a flat 2-D layout to a folded 3-D structure, the patent creates multiple accessible surfaces and levels. Components can be positioned on different faces of the folded PCB, allowing maintenance personnel to access components without disassembling the entire device, thus preserving testability while reducing footprint.
3Device complexity
If the number of electronic components is reduced to simplify the circuit board, then manufacturing complexity is reduced, but the number of available features is reduced
Solution Approach 1:
The flexible PCB structure serves multiple functions simultaneously: it acts as the circuit board substrate, provides EMI shielding through integrated conductive layers, enables compact 3-D packaging, and facilitates heat dissipation through its folded geometry. This multi-functionality allows the system to maintain complex features without proportionally increasing manufacturing complexity.
Solution Approach 2:
The patent uses composite material structures in the flexible PCB, combining conductive layers for EMI shielding with flexible substrate materials. This composite approach integrates multiple functions (structural support, electrical connectivity, EMI protection) into a single component, reducing the need for separate parts while maintaining feature richness.
4Object-affected harmful factors
If a conventional EMI shielding container is used to protect electronic components, then EMI protection is provided, but device complexity and size are increased
Solution Approach 1:
The patent merges the EMI shielding function with the flexible PCB structure itself. Conductive layers are integrated directly into the flexible PCB, eliminating the need for separate EMI shielding containers or enclosures. This integration provides EMI protection while reducing device complexity and overall size.
Solution Approach 2:
The flexible PCB serves dual purposes: as the structural circuit board substrate and as the EMI shielding barrier. The conductive layers within the flexible PCB provide electromagnetic interference protection without requiring additional dedicated shielding components, thereby reducing device complexity while maintaining EMI protection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for a significant reduction in circuit board size without increasing overall system height, enhancing volumetric efficiency and enabling additional components without compromising performance or testability.
Implementation Method 1
shielded flexible PCB (FPC) electromagnetic interference (EMI) enclosure
Data Source
AI summary
Three-dimensional (3-D) volumetric board architectural design provides technical solutions to technical problems facing miniaturization of circuit boards. The 3-D volumetric architecture includes using more of the unused volume in the vertical dimension (e.g., Z-dimension) to increase the utilization of the total circuit board volume. The 3-D volumetric architecture is realized by mounting components on a first PCB and on a second PCB, and inverting and suspending the second PCB above the first PCB. The use of 3-D volumetric board architectural design further enables formation of a shielded FEMIE, providing shielding and improved volumetric use with little or no reduction in system performance or increase in system Z-height.