Printed Circuit Assembling TRIZ Cases

Segmented adhesive layers with varying viscosities optimize conductive ball distribution, reducing contact resistance and indentation dispersion.

A conductive material synchronizes binder resin curing with solder melting to lower connection resistance.

Metal members accelerate thermosetting resin curing at lower temperatures, reducing thermal deformation and manufacturing costs.

Channels in an additively manufactured receptacle direct heated gas to melt solder between contacts.

Multiple height measuring instruments on a board supporter measure surface portions simultaneously, reducing takt time for component installation.

Separated power distribution card layout isolates control devices from switching components to reduce operating temperature.

Side lead extraction resolves overhang risks during insertion, improving yield rates.

Hole-forming portions in the resist mask promote localized etching of the sacrificial layer, enabling easier probe detachment without deformation.

Vertical terminal bending connects the Chip-On-Film component to the display substrate, avoiding inorganic insulating layer cracks and improving yield.

A conductor covers substrate terminal adjacent portions to prevent electrode burrs from causing short-circuits during electronic component assembly.

A mid-mounted smoke chamber extends through a circuit board to expose its interior region to air from both surfaces.

A modular frame and backing plate assembly secures processors using fewer mounting holes.

Multi-stage connection pads route test signals through functional I/O pins to verify substrate continuity without increasing die size.

Modular RF shield system with conductive outer surface and non-conductive inner material secures coaxial cable connections to ball grid arrays.

Forming recesses in joint portions allows fitting replacement pieces with UV curing adhesive, improving connection strength.

Test coupons verify back drill depth via impedance measurement to resolve stub removal precision issues.

Consolidating multiple electricity meters into a single detection unit, the calculation unit computes total energy consumption from operational parameters.

A trench between the terminal and side surface enables high yield by preventing damage during substrate separation.

Removing the lower case eliminates sandwich structure complexity while the bracket distributes loads to protect solder joints from cracks.

Insulating endcap vias connect decoupling capacitors to PCBs, reducing noise in signal transmission while freeing surface area for additional components.

Selective plating on facing side surfaces prevents corrosion while maintaining solder wettability to eliminate voids.

Ground terminals contact shielding members to establish electrical conduction while signal terminals remain isolated within insulating accommodating portions.

A curved HIFU transducer uses compliant electrical contacts to maintain reliable connections during thermal cycling.

Ejecting member presses paste pot inner lid via elastic pad and protruding portion, suppressing residue on container walls during ejection.

Bonded laminate wiring board with stacked embedded capacitors resolves interconnection flexibility limits for multi-core microprocessors.

Segmenting a carrier into solder-repellent and attracting areas guides component placement, resolving uneven light distribution caused by imprecise mounting.

Photo imageable dielectric layer shields conductive bumps from oxidation, improving chip package yield.

Silver paste blends copper and manganese particles to boost conductivity while resisting electromigration and solder heat damage.

Selective electrical connections between cascaded buck converters enable dynamic voltage boosting, eliminating unused components and reducing mounting area.

Conductive adhesive bonds connector pads directly to board pads in a single plane, eliminating thick vertical connectors that increase device thickness.

A driver board assembly embeds power devices within a printed circuit board substrate to reduce volume and inductance.

Metal frames absorb inductor vibrations via elastic force, reducing acoustic noise transmission while distributing heat to prevent thermal shocks.

Irregular connector pad geometry guides correct mounting orientation to maintain high-speed signal integrity.

A socket loading mechanism uses a cam and ramp system to apply load directly to an integrated circuit.

An electroconductive plate or tape wound around protruding wire portions lowers characteristic impedance, resolving manufacturing efficiency trade-offs.

Standardized resist openings decouple connection pad geometry from solder bump formation, ensuring uniform heights for precise chip terminal alignment.

A shielding conductor forms symmetrical magnetic field loops to cancel common mode currents on an electronic board.

A bulk feeder mounts electronic parts directly onto circuit boards without taping or packing.

A stretchable device uses a connection member to join facing wirings across substrates.

Folding a flexible PCB into a 3-D volumetric layout reduces circuit board footprint while maintaining component testability and system performance.

A camera module packaging body uses cambered inner surfaces to facilitate demolding and prevent structural damage during manufacturing.

Integrating a support member with the conductive shield fixes cables vertically, reducing mounting space constraints.

Thixotropic dielectric filler seals chips in embedded cavities, eliminating via hole processing complexity and costs.

Sintering metal nanoparticles onto ceramic substrates creates high thermal conductivity pathways that mitigate overheating in multi-layer PCBs.

Embedded metal pads eliminate solder resist layers to reduce bump pitch and increase I/O routing density.

A segmented electrical connector uses vertical fixing grooves to join independent first and second terminals for stable assembly.

Internal connecting conductors increase equivalent series resistance in high frequency bands, suppressing ringing phenomena without consuming switching current.

A conductive copper paste uses fatty acid and triethanolamine to enable ambient curing.

Replacing gold plating with removable OSP films lowers production costs while maintaining reliable electrical conductivity.

A single anisotropic conductive film connects driver ICs and flexible printed circuits to common wires on a substrate.