Segmented Gold Finger Electroplating via Side Lead Extraction
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Solution Overview
Problem
The existing method of electroplating gold fingers on printed-circuit boards is prone to overhang issues, which can lead to short circuits during device insertion and removal, and results in reduced yield and increased costs due to alignment and accuracy problems.
Innovation Solution
A method involving first etching to form segmented gold fingers with a lead channel and side leads, followed by solder resist protection, partial gold finger coverage, parallel exposure, electroplating, and second etching to remove the side lead, ensuring accurate dimensional control and alignment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If the lead is arranged between adjacent gold fingers to connect conductive wires, then the gold fingers can be connected, but overhang occurs during insertion and removal causing short circuit risk
Solution Approach 1:
The patent extracts the lead from the space between gold fingers and relocates it to the side of the gold finger structure. This removes the interfering element (lead) from the problematic position, eliminating the overhang issue while preserving the connection function through alternative routing paths.
Solution Approach 2:
The patent transitions the lead arrangement from a horizontal configuration (between gold fingers) to a vertical/side configuration (along the edge of the substrate). This dimensional change moves the lead out of the insertion/removal path, preventing overhang while maintaining electrical connectivity through the side lead structure.
2Adaptability or versatility
If the lead is removed after electroplating gold completion, then the design requirement is met, but the process becomes complex and time-consuming
Solution Approach 1:
The patent performs the lead removal action in advance during the first etching stage, before the gold electroplating process. By preparing the lead channel and side lead structure beforehand, the design flexibility is achieved without adding post-plating complexity, as the lead structure is already in its final configuration.
3Measurement precision
If dimensional detection is performed after electroplating, then accuracy can be verified, but adjustments cannot be made and products must be scrapped if out of tolerance
Solution Approach 1:
The patent performs dimensional detection and verification during the first etching stage, before electroplating. This preliminary measurement allows for immediate adjustments to the lead channel and side lead structures while they are still in a modifiable state, ensuring dimensional accuracy is achieved before the irreversible plating process, thereby preventing scrap and improving yield.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively avoids overhang issues, improves product accuracy, reduces defective products, and simplifies the manufacturing process, enhancing the yield rate and reducing costs by allowing for timely adjustments during the first etching stage.
Implementation Method 1
a copper surface of most of the gold fingers is required to be covered with electroplating gold
Implementation Method 2
first etching, forming circuit patterns and gold finger parts on the substrate
Implementation Method 3
parallel exposure to perform image transfer
Data Source
AI summary
A method of a segmented electroplating golden finger includes a substrate, which is drilled and plated, and including: a. first etching, forming circuit patterns and gold finger parts on the substrate, the gold finger part is composed of several mutually independent gold fingers, a lead channel is provided between the two adjacent gold fingers, and a side lead connected to each gold finger is arranged on the lead channel; b. solder resist, solder resist protection for the etched substrate; c. the gold fingers partly covered with a wet film; d. parallel exposure to perform image transfer; e. gold finger electroplating; f. adhesive glue; g. second etching, removing the leads, completing a finished product.