Conductive Paste with Cu-Mn Composite for Electromigration Resistance
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Solution Overview
Problem
Conductive pastes used for forming conductor patterns on substrates face issues with electromigration resistance, solder heat resistance, and adhesiveness to substrates, with existing solutions either compromising conductivity or increasing manufacturing complexity.
Innovation Solution
A conductive paste comprising silver powder, glass frit, an organic binder, and a Cu element, along with at least one metal element selected from V, Cr, Mn, Fe, and Co, which enhances electromigration resistance, solder heat resistance, and adhesiveness to the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If silver powder is used as conductive material, then electromigration resistance is improved, but solder heat resistance and adhesiveness to substrate deteriorate
Solution Approach 1:
The patent uses a composite powder containing silver particles (50-90 mass%), copper particles (5-40 mass%), and ceramic particles (1-40 mass%) to create a conductive paste that achieves both high electromigration resistance (from silver) and improved solder heat resistance and adhesiveness (from copper and ceramic components). This composite approach allows simultaneous optimization of multiple conflicting properties.
2Reliability
If copper powder is used as conductive material, then cost and conductivity are improved, but oxidation resistance deteriorates
Solution Approach 1:
The conductive paste uses a composite powder where copper particles are combined with ceramic particles (such as alumina, silica, or boron nitride) that provide oxidation resistance. The ceramic component protects the copper from oxidizing during storage and processing while maintaining the high conductivity contribution from the copper particles.
3Strength
If coating material is added to silver powder surface, then solder heat resistance is improved, but manufacturing process complexity increases
Solution Approach 1:
The patent combines the conductive metal particles (silver and copper) with ceramic particles in a single mixed powder composition, eliminating the need for separate coating steps. The ceramic particles are incorporated directly into the powder mixture along with the metals, simplifying the manufacturing process while still providing the desired solder heat resistance and adhesiveness properties.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The conductive paste achieves excellent electromigration resistance, solder heat resistance, and adhesiveness to substrates while maintaining high conductivity, simplifying the manufacturing process.
Implementation Method 1
a sintering type in which conductivity is ensured by sintering of the metal particles to each other by sintering
Data Source
AI summary
A conductive paste including (A) a silver powder, (B) a glass frit, (C) an organic binder and (D) a powder containing Cu and at least one metal element selected from the group consisting of V, Cr, Mn, Fe and Co. The powder (D) may thus contain Cu and Mn, Cu and Fe or Cu and Co. The conductive paste has a desirable electromigration resistance, solder heat resistance and adhesiveness to a substrate.