Socket Loading Mechanism for ICs Using Cam and Ramp
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Solution Overview
Problem
Existing socket loading mechanisms for integrated circuits (ICs) are not scalable for next-generation processors, create keep-out zones on printed circuit boards (PCBs) that reduce available space for wiring, and result in increased power loss and complexity in PCB layout.
Innovation Solution
The proposed socket loading mechanism uses a ramp mechanism with a cam and tightener system to load ICs into sockets, reducing the need for mounting holes and keep-out zones, thereby allowing for more efficient PCB layout and reduced power loss.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If conventional socket loading mechanisms are used, then ICs can be loaded into sockets, but mounting holes and keep-out zones are created on PCBs that reduce available space for wiring and increase layout complexity
Solution Approach 1:
The patent extracts and eliminates the need for mounting holes and keep-out zones by using a socket loading mechanism that applies load through the IC package itself rather than requiring separate mounting structures. The loading mechanism engages with features on the IC package (such as protrusions or edges) and applies force directly through the package to the socket, removing the requirement for additional mounting holes and associated keep-out zones on the PCB.
Solution Approach 2:
The socket loading mechanism is designed to be universally applicable to different IC packages by engaging with common package features rather than requiring package-specific mounting holes. The mechanism can accommodate various IC types (e.g., QFP, BGA, CSP) by utilizing their existing package structures, thereby eliminating the need for dedicated mounting features across different IC designs.
2Loss of energy
If conventional socket loading mechanisms with mounting holes are used, then ICs can be secured, but power loss increases due to longer wiring paths
Solution Approach 1:
The invention removes the intermediate mounting hole structures that force longer wiring paths. By loading the IC directly through its package into the socket without requiring separate mounting holes, the PCB trace paths become shorter and more direct, reducing resistance and inductance, thereby decreasing power loss.
3Adaptability or versatility
If scalable socket loading mechanisms are not used, then current ICs can be loaded, but next-generation processors cannot be accommodated
Solution Approach 1:
The socket loading mechanism is designed with universal engagement features that can interface with various IC package types including current and next-generation processors. The mechanism uses general package features (edges, protrusions, or structural elements) rather than IC-specific mounting features, allowing it to adapt to evolving processor designs while maintaining reliable loading functionality.
Solution Approach 2:
The loading mechanism incorporates dynamic elements such as springs or flexible components that allow adjustment of loading force and position. This dynamic capability enables the mechanism to accommodate variations in IC package dimensions and characteristics across different generations while maintaining consistent and reliable loading performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables easier and less complex wiring on PCBs, reduces power loss by allowing components to be closer to the IC, and provides a scalable solution for different ICs, including next-generation processors.
Implementation Method 1
a cam engageable with the ramp, rotation of the tightener to cause relative movement between the cam and the ramp to displace the collar to apply a load to the IC
Data Source
AI summary
Systems, apparatus, articles of manufacture, and methods are disclosed to load an integrated circuit (IC) into a socket. An example apparatus to load an IC in a socket includes: a collar; a tightener; a ramp carried by at least one of the collar or the tightener; and a cam carried by at least another one of the collar or the tightener, the cam engageable with the ramp, rotation of the tightener to cause relative movement between the cam and the ramp to displace the collar to apply a load to the IC.