Conductive Material Synchronized Curing Melting
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Solution Overview
Problem
Conventional anisotropic conductive materials exhibit high connection resistance and low conduction reliability when used to electrically connect electrodes, particularly due to the mismatch in thermal curing and melting profiles of the binder resin and solder components.
Innovation Solution
A conductive material comprising a binder resin with a curable compound and a thermal curing agent, where the exothermic peak temperature of the binder resin is lower than the endothermic peak temperature of the solder, ensuring a synchronized curing and melting process to reduce connection resistance and enhance reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional anisotropic conductive material is used to connect electrodes, then the connection structure can be formed, but the connection resistance increases and conduction reliability decreases
Solution Approach 1:
The patent changes the thermal parameters of the binder resin by selecting specific curable compounds and thermal curing agents, adjusting the exothermic peak temperature to be lower than the solder melting temperature. This parameter optimization ensures synchronized curing and melting processes, resolving the contradiction between connection resistance and conduction reliability.
Solution Approach 2:
The patent uses a composite binder resin system comprising a curable compound and a thermal curing agent, combined with solder-coated conductive particles. This composite material design enables coordinated thermal behavior during curing, simultaneously achieving low connection resistance and high conduction reliability.
2Manufacturing precision
If the binder resin and solder are heated at the same rate, then the curing and melting processes occur, but the temperature mismatch causes poor connection quality
Solution Approach 1:
The patent designs the binder resin to start curing before the solder melts by lowering the exothermic peak temperature. This preliminary action ensures that the binder resin begins to cure while the solder is still in a solid or partially melted state, allowing for better control of the connection process and improved connection quality.
Solution Approach 2:
The patent utilizes the phase transition of the solder (solid to liquid) and the chemical reaction phase transition of the binder resin (uncured to cured) in a coordinated manner. By matching the exothermic peak temperature of the binder resin to be lower than the melting temperature of the solder, the patent ensures that both phase transitions occur in an optimal sequence, improving connection quality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The conductive material effectively decreases connection resistance and improves reliability by ensuring the solder melts after the binder resin starts curing, maintaining a stable connection under high temperature and humidity conditions and thermal shocks.
Implementation Method 1
the binder resin includes a curable compound capable of being cured by heating, and a thermal curing agent
Implementation Method 2
an endothermic peak top temperature in melting of the solder
Data Source
AI summary
The conductive material according to the present invention includes a binder resin and conductive particles each having a solder at a conductive surface, the binder resin includes a curable compound capable of being cured by heating, and a thermal curing agent, and when the binder resin and the solder in the conductive particle are each heated at a temperature rising rate of 10° C./minute to perform differential scanning calorimetry, an exothermic peak top temperature in curing of the binder resin is lower than an endothermic peak top temperature in melting of the solder.