Cambered Packaging Body for Camera Module Demolding
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Solution Overview
Problem
The challenge in camera module manufacturing is the difficulty in assembling thinner and lighter camera modules due to the increasing size and complexity of electronic components, which affects imaging quality and limits the miniaturization of smart devices.
Innovation Solution
A photosensitive assembly with a packaging body featuring cambered surfaces on its inner side, facilitating demolding and enhancing the connection between the photosensitive chip and circuit board, while reducing material usage and preventing adhesive flow to the photosensitive region, thereby improving the structural strength and imaging quality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the photosensitive chip area is increased to improve imaging quality, then the imaging quality is improved, but the assembling difficulty increases and the camera module size increases
Solution Approach 1:
The patent merges the packaging body formation process with the photosensitive chip bonding process. The packaging body is formed by injection molding directly over the photosensitive chip that is already bonded to the circuit board, combining what were previously separate manufacturing steps into one integrated process. This reduces assembling difficulty while maintaining the larger photosensitive chip area needed for high imaging quality.
2Manufacturing precision
If the photosensitive chip area is increased to improve imaging quality, then the imaging quality is improved, but the camera module size increases
Solution Approach 1:
The patent implements nesting by placing the photosensitive chip within the packaging body structure. The packaging body is molded to encompass the photosensitive chip and circuit board assembly, creating a compact nested configuration. This allows the larger photosensitive chip area needed for high imaging quality to be contained within a space-efficient arrangement, reducing the overall camera module volume.
3Ease of manufacture
If the packaging body is made by injection molding, then the packaging body is formed, but the top surface may be warped up during demolding which reduces die imaging quality
Solution Approach 1:
The patent applies curvature to the inner side surface of the packaging body, specifically designing it as a cambered surface rather than a flat surface. This curved geometry facilitates uniform stress distribution during demolding, preventing the top surface from warping up. The cambered surface maintains the packaged components in their correct positions and orientations, preserving die imaging quality while enabling successful injection molding formation.
Data Source
AI summary
The present disclosure relates to a camera module and a photosensitive assembly thereof. The photosensitive assembly comprises includes a circuit board, a photosensitive chip, and a packaging body. The photosensitive chip is connected to the circuit board. The packaging body is formed on the circuit board. A through hole is formed in the packaging body. The through hole is opposite to the photosensitive chip to provide a light channel of for the photosensitive chip. An inner side surface of the through hole comprises includes a first cambered surface, a connection surface, and a second cambered surface, and the first cambered surface and the second cambered surface are respectively connected to two ends of the connection surface. In the photosensitive assembly, both the upper and lower ends or the inner side surface of the package are provided to as cambered surfaces, which facilitate the demolding of the molding device of the packaging body and avoids damage to the packaging body by the molding device in the demolding step.