Thermosetting Resin Solder Paste for PCB Bonding
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Solution Overview
Problem
The challenge is to manufacture printed circuit boards with high bonding reliability and low manufacturing costs, while minimizing thermal deformation and avoiding the high temperature and long curing times associated with thermosetting resin-containing solder pastes, which can degrade electronic components and increase production time.
Innovation Solution
A method involving the use of thermosetting resin-containing solder paste with metal members arranged around solder joints, where the thermosetting resin is cured at a lower temperature in contact with both the solder and metal members, accelerating the curing process and reducing the need for extended heating times.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If thermosetting resin-containing solder paste is used to bond electronic components, then bonding reliability is improved, but manufacturing cost increases due to additional underfill material steps
Solution Approach 1:
The patent combines the solder paste with thermosetting resin to create a composite material that integrates both soldering and reinforcement functions into a single application step, eliminating the need for separate underfill material application and curing steps
2Strength
If thermosetting resin is cured at high temperature for long duration, then bonding strength is improved, but electronic components suffer thermal deformation and quality degradation
Solution Approach 1:
The patent modifies the chemical composition and curing characteristics of the thermosetting resin in the solder paste to enable effective curing at lower temperatures and shorter durations, thereby preventing thermal deformation of electronic components while maintaining bonding strength
Solution Approach 2:
The patent uses a composite material consisting of solder particles dispersed in thermosetting resin, where the resin provides both bonding and reinforcement functions, allowing for optimized curing parameters that protect electronic components from thermal damage
3Volume of moving object
If solder joints are miniaturized to increase electrode terminals, then package size is reduced, but mechanical strength of solder joints deteriorates
Solution Approach 1:
The patent employs a composite solder paste containing thermosetting resin that, when cured, forms a reinforced structure around miniaturized solder joints, providing enhanced mechanical strength that compensates for the reduced size of the solder joints themselves
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances bonding reliability, reduces thermal deformation, and lowers manufacturing costs by shortening the curing time of the thermosetting resin, even when using low heating temperatures, thus maintaining the quality of electronic components and reducing production time.
Implementation Method 1
the thermosetting resin existing around the solder joint is cured and bonded to the solder joints
Implementation Method 2
the solder in the solder paste containing the thermosetting resin is separated from the thermosetting resin at a temperature not lower than the melting point of solder
Implementation Method 3
the resin is cured in a state of being held in contact with the solder and the metal members
Data Source
AI summary
An electronic component is mounted on the mounting face of a printed wiring board and a plurality of terminals arranged on the mounting face of the printed wiring board are respectively bonded to a plurality of terminals arranged on the bottom surface of the electronic component by means of solder. Solder paste containing powdery solder and thermosetting resin is provided to the plurality of terminals on the mounting face, then the electronic component is mounted on the mounting face of the printed wiring board, and subsequently the solder paste is heated to bond the corresponding terminals by means of molten solder. Thereafter, the molten solder is allowed to solidify and the thermosetting resin separated from the solder paste is allowed to cure in a state where it is held in contact with metal members arranged separately relative to the terminals.