Multi-piece PCB Replacement Using UV Curing Adhesive

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Solution Overview

Problem

Existing multi-piece boards with frames and printed wiring parts face challenges in efficiently replacing defective pieces without wasting good pieces and ensuring strong adhesion between frames and pieces, leading to issues with yield and reliability.

Innovation Solution

A fabrication method involving checking for defective pieces, forming recesses and projections, fitting good pieces into corresponding recesses, flattening joint portions, and filling UV curing adhesive to secure the frames and pieces, which enhances connection strength and precision.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If defective pieces are replaced by cutting and attaching new pieces, then yield is improved, but connection strength between frame and piece deteriorates

Engineering Contradiction:
ImproveyieldVSAvoidconnection strength
Core Design Contradiction:
ProductivityVSStrength

Solution Approach 1:

Recesses and projections are formed in advance during the board fabrication process before any replacement occurs. This preliminary preparation ensures that when pieces need replacement, the structural features for strong connection already exist, eliminating the need for weakening cuts during replacement operations.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The joint portions between frame and pieces are given special local structural features (recesses and projections) that provide enhanced connection strength specifically at these critical interfaces, while the rest of the board maintains its standard structure for ease of replacement.

Inventive Principle:
Principle #3Local quality

2Ease of repair

If pieces are replaced by cutting and attaching, then defective pieces can be removed, but manufacturing precision deteriorates

Engineering Contradiction:
Improveease of replacementVSAvoidjoint portion precision
Core Design Contradiction:
Ease of repairVSManufacturing precision

Solution Approach 1:

The recesses and projections are formed with precise dimensions during the initial board fabrication using standard manufacturing processes. This preliminary precision work ensures that subsequent replacement operations can be performed easily without requiring high-precision cutting or alignment operations.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The recesses and projections act as intermediary structural features that mediate between the frame and replacement pieces. These pre-formed features serve as guides and mechanical interlocks that automatically ensure precise alignment and positioning during replacement, eliminating the need for high-precision manual alignment.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Strength

If adhesive is applied to join frame and piece, then connection strength is improved, but air bubbles in adhesive reduce reliability

Engineering Contradiction:
Improveadhesion strengthVSAvoidmounting reliability
Core Design Contradiction:
StrengthVSReliability

Solution Approach 1:

Recesses are formed specifically in the joint portions where adhesive will be applied. These localized recesses concentrate the adhesive in controlled areas, ensuring complete filling without trapping air bubbles, while the rest of the board surface remains flat for other purposes.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The recesses create a vertical dimension in the joint portions, allowing adhesive to be contained and compressed into a thin, bubble-free layer. This dimensional feature ensures the adhesive fills the joint completely from above without air entrapment, while maintaining a flat overall board surface.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method allows for efficient replacement of defective pieces, improving yield and connection strength between frames and pieces, reducing waste and ensuring high reliability in electronic part mounting.

Implementation Method 1

filling a UV-curing adhesive in a recess and curing the adhesive to adhere the frame and good piece

Methodology Applied
Scientific EffectPhotopolymerisation: Photopolymerisation

Data Source

PatentUS8698004B2Multi-piece board and fabrication method thereof
Publication Date: 2014.04.15 IBIDEN CO LTD
  • US8698004B2 patent drawing
  • US8698004B2 patent drawing
  • US8698004B2 patent drawing

AI summary

A fabrication method for a multi-piece board includes: checking whether pieces (printed wiring boards) are defect-free or not; forming a first recess in a joint portion between a defective piece and a frame; forming a first fitting portion at the frame by separating the defective piece; cutting out a defect-free piece having a second fitting portion from another board; forming a second recess in the second fitting portion; fitting the second fitting portion into the first fitting portion; flattening a joint portion; and filling an adhesive in a third recess which is formed by the first recess and the second recess, and curing the adhesive to adhere the frame and the defect-free piece.