Planar Cable Connector Adhesive Bonding for Thin Devices
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Solution Overview
Problem
Current cable and circuit board connectors are thick and expensive, limiting the thinness of computing devices and requiring cables to be elevated above the board, increasing device thickness.
Innovation Solution
A system with a planar connector end and a cable connection portion on the circuit board, using conductive epoxy to create a permanent electrical bond between connector and board pads, allowing for a low-profile, flush mounting of cables to circuit boards.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional clamp and lock connectors are used, then reliable electrical connection is achieved, but device thickness increases due to connector thickness (2mm or more)
Solution Approach 1:
The patent merges the connector and circuit board into a single planar structure where the connector end and circuit board lie in the same plane. This eliminates the need for thick vertical connectors by integrating the connection function directly onto the board surface, thereby reducing device thickness while maintaining connection reliability through the adhesive bonding and electrical contact between connector pads and board pads.
Solution Approach 2:
The patent extracts the traditional thick vertical connector structure and replaces it with a planar connector end that lies flat against the circuit board. By removing the vertical elevation requirement, the design eliminates the thickness penalty associated with traditional connectors while preserving the essential electrical connection function through surface-mounted pads and adhesive bonding.
2Reliability
If cables are elevated above the circuit board using traditional connectors, then electrical connection is established, but device thickness increases
Solution Approach 1:
The patent merges the cable connector and circuit board into a coplanar arrangement where both lie in the same plane. This integration eliminates the need for cable elevation above the board, allowing the device to achieve a thinner profile while maintaining reliable electrical connection through the planar pad-to-pad contact and adhesive bonding system.
3Strength
If traditional thick connectors are used, then secure mechanical connection is achieved, but manufacturing cost increases
Solution Approach 1:
The patent replaces the traditional mechanical connector system (clamps, locks, and elevated plugs) with a planar adhesive-bonded system. The mechanical connection strength is achieved through the adhesive material bonding the connector pads to board pads in the same plane, eliminating the need for complex mechanical fastening mechanisms and reducing manufacturing complexity and cost.
4Length of stationary object
If planar connector ends with adhesive bonding are used, then device thickness is reduced, but connection reliability must be maintained
Solution Approach 1:
The patent uses composite material structures where conductor pads are bonded to the circuit board using adhesive materials. This composite approach combines the electrical conductivity of metal pads with the bonding strength of adhesive materials, achieving both thin profile and reliable electrical connection through the integrated pad-adhesive-board structure.
Solution Approach 2:
The patent changes the connection parameters from traditional mechanical engagement (vertical insertion, clamping force) to planar adhesive bonding (surface contact, adhesive shear strength). This parameter change enables a thinner profile while maintaining connection reliability through the adhesive bonding mechanism and electrical contact between coplanar pads.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables thinner computing devices by reducing connector thickness and eliminating the need for separate connectors, providing a secure and efficient electrical connection.
Implementation Method 1
The connector pads and the board pads are to be adhered together using a conductive adhesive material to form an electrical bond between the connector pads and the board pads
Data Source
AI summary
A method and device are provided. The device includes a system component that has a circuit board that includes a cable connection portion. The cable connection portion is disposed on and extends along a mounting surface, and includes board pads disposed on the mounting surface within the cable connection portion. The board pads define corresponding board contact surfaces for electrical coupling with connector pads, and include a board adhesive material disposed on the corresponding board contact surfaces.