Chip-Embedded PCB Thixotropic Dielectric Filler
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Solution Overview
Problem
Conventional printed circuit boards require complex processing steps to create via holes for electrical connections, leading to increased costs and device complexity, especially as demand grows for smaller, high-density electronic components.
Innovation Solution
A chip-embedded printed circuit board design that eliminates via wiring by forming a cavity in the board, using a thixotropic dielectric filler with high aspect ratio particles and UV-curable acrylate oligomers to seal the chip, and providing interposers for electrical connections, leveraging shear thinning properties for smooth gap filling and thermal conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If via holes are formed for electrical connections between wiring layers and chip, then electrical connection is achieved, but processing complexity and costs increase
Solution Approach 1:
The invention extracts and eliminates the via hole formation step from the conventional PCB manufacturing process. By using chip embedding technology where the chip is directly mounted on the PCB surface without requiring through-holes, the complex drilling, plating, and filling operations are removed while maintaining electrical connection functionality through alternative means such as surface-mounted interconnects.
2Reliability
If conventional mounting methods are used, then chip is secured, but gap filling and sealing require additional processing steps
Solution Approach 1:
The invention merges multiple functions into a single integrated underfill material: mechanical bonding, gap filling, void prevention, and electrical insulation. This multifunctional material is applied in one step during chip mounting, eliminating the need for separate gap filling and sealing operations that would otherwise be required in conventional manufacturing processes.
3Area of stationary object
If high-density mounting is implemented, then surface area utilization improves, but via hole formation becomes more complex
Solution Approach 1:
The invention removes the via hole formation requirement entirely from high-density mounting applications. By采用 chip embedding technology, the complex via drilling and filling operations are eliminated, allowing higher component density to be achieved through direct surface mounting without the scaling complexity that would otherwise accompany via hole formation at high densities.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces processing complexity and costs while enabling high-resolution, high-density mounting of electronic components with improved thermal management and compatibility with z-height laser detection systems.
Implementation Method 1
leveraging shear thinning properties for smooth gap filling
Implementation Method 2
an acrylate oligomer, a photoinitiator that absorbs light with a wavelength of about 280 to about 320 nanometers, and a photoinitiator that absorbs light with a wavelength of about 320 to about 400 nanometers
Implementation Method 3
leveraging shear thinning properties for smooth gap filling and thermal conductivity
Data Source
AI summary
A chip-embedded printed circuit board includes a cavity in a printed circuit board, a chip in the cavity of the printed circuit board, and a thixotropic dielectric filler in a gap in the cavity to seal the chip in the printed circuit board.