Display Panel Narrow Bezel via Vertical Terminal Bending
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Solution Overview
Problem
Current display panel manufacturing techniques with narrow bezels face issues such as yield problems, display failures due to cracks in the inorganic insulating layer, increased process difficulty, and reduced production efficiency, along with low substrate utilization, especially in the terminal bending process.
Innovation Solution
A display panel design featuring a display substrate with a connection hole and an electrical connector, where a Chip-On-Film (COF) component with an integrated circuit chip is attached to the substrate using an anisotropic conductive paste, allowing for electrical connection without terminal bending, thereby simplifying the manufacturing process and improving substrate utilization.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If connection terminal bending process is used to achieve narrow bezel, then bezel width is reduced, but yield decreases due to cracks in inorganic insulating layer
Solution Approach 1:
Instead of bending the terminal region horizontally to achieve narrow bezel, the patent inverts the approach by bending the terminal region vertically downward along the edge of the substrate. This vertical bending direction avoids the horizontal compression that causes cracks in the inorganic insulating layer, thereby maintaining display yield while achieving the narrow bezel effect.
Solution Approach 2:
The patent transitions from horizontal terminal bending (in-plane) to vertical terminal bending (out-of-plane). By changing the bending dimension from the substrate plane to the vertical direction, the terminal region can achieve narrow bezel configuration without subjecting the inorganic insulating layer to damaging horizontal compressive stresses.
2Length of stationary object
If connection terminal bending process is used, then narrow bezel is achieved, but process difficulty increases
Solution Approach 1:
The patent simplifies the manufacturing process by inverting the bending direction from horizontal to vertical. This inversion eliminates the need for complex mask processes and selective removal of inorganic insulating layers that are required in horizontal bending methods, thereby reducing process difficulty while maintaining narrow bezel achievement.
3Length of stationary object
If connection terminal bending process is used, then narrow bezel is achieved, but production efficiency decreases
Solution Approach 1:
By inverting the bending direction to vertical, the patent eliminates multiple complex process steps including mask formation, selective etching, and inorganic insulating layer removal. This streamlined vertical bending process reduces manufacturing cycles and improves production efficiency while achieving the desired narrow bezel configuration.
4Length of stationary object
If connection terminal bending process is used, then narrow bezel is achieved, but substrate utilization ratio decreases
Solution Approach 1:
The vertical bending approach allows the terminal region to be folded downward along the substrate edge rather than requiring a large horizontal bending region. This inversion enables more efficient use of substrate area, as the bent terminal region occupies less lateral space and can be positioned more compactly at the substrate perimeter, thereby increasing substrate utilization ratio.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the production of display panels with a narrow bezel configuration while reducing manufacturing costs and improving production efficiency by eliminating the need for terminal bending, thus avoiding display failures and enhancing substrate utilization.
Implementation Method 1
The bonding layer is formed of an anisotropic conductive paste
Implementation Method 2
a bonding layer for bonding the COF film to a face of the display substrate
Data Source
AI summary
The present disclosure relates to a display panel and a method of fabricating the same, and a display device. A display panel is provided which comprises: a display substrate having a first face and a second face opposite to the first face, the display substrate including a display area and a non-display area in the first face; a Chip-On-Film (COF) component disposed on the second face, the Chip-On-Film component comprising a COF film and an integrated circuit (IC) chip on the COF film; a connection hole located in the non-display area and at least penetrating the display substrate and the COF film; and an electrical connector disposed in the connection hole and electrically connecting the display substrate and the Chip-On-Film component.