Probe Detachment via Resist Mask Etching Pathways
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Solution Overview
Problem
The existing probe manufacturing process is complicated and time-consuming due to the difficulty in detaching probes from a silicon base table without damaging them, as the etching process requires careful observation to ensure minimal sacrificial layer remains for easy detachment and to prevent probe deformation.
Innovation Solution
A method involving a resist mask with a hole-forming portion to promote etching of the sacrificial layer from the edge of the opening, allowing for a shorter etching time and easier detachment of the probe by leaving a partial sacrificial layer to support the probe during detachment, reducing the need for strong external forces and simplifying the process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If the probe is soaked in etchant until the sacrificial layer is completely removed, then the probe can be detached from the base table, but the probe itself may be damaged by the etchant and the etching process takes too long
Solution Approach 1:
A hole-forming portion is formed in the resist mask before the etching process to pre-establish an etching pathway. This allows etchant to reach the sacrificial layer quickly and create openings, enabling probe detachment without prolonged exposure to etchant that would damage the probe.
Solution Approach 2:
The resist mask is divided into a probe-forming portion and a hole-forming portion. The hole-forming portion creates localized openings in the sacrificial layer, segmenting the etching process into controlled regions that facilitate probe release while limiting overall etchant exposure time.
2Stability of the object's composition
If a large amount of sacrificial layer remains after etching, then the probe can be held on the base table, but strong external force is required for detachment which may deform the probe
Solution Approach 1:
The hole-forming portion in the resist mask pre-establishes etching pathways before the etching process begins. This allows controlled removal of sacrificial layer material in specific regions, creating optimal remaining sacrificial layer thickness that provides just enough holding force for positioning while enabling easy detachment without requiring strong external forces.
Solution Approach 2:
The etching process is localized through the hole-forming portion, creating different sacrificial layer thicknesses in different regions. The remaining sacrificial layer under the probe maintains sufficient thickness for stable positioning, while etched openings in the hole-forming portion regions provide detachment pathways without compromising overall probe structural integrity.
3Device complexity
If conventional etching process is used without hole-forming portion, then the process is simpler in terms of mask design, but the etching process takes too long and requires careful observation
Solution Approach 1:
The hole-forming portion is integrated into the resist mask design before deposition, pre-establishing etching pathways. This preliminary structural feature accelerates the etching process by providing direct routes for etchant to reach and remove sacrificial layer material, significantly reducing etching time and eliminating the need for prolonged careful observation.
Solution Approach 2:
The hole-forming portion is merged with the probe-forming portion in a single integrated resist mask. This combination achieves both probe patterning and accelerated etching functions in one mask structure, maintaining design simplicity while dramatically reducing etching process time through the built-in etching pathways.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables faster and easier detachment of probes without damaging them, simplifying the manufacturing process and reducing the time required for etching, while maintaining the probe's integrity and reducing the risk of deformation.
Implementation Method 1
by removing the sacrificial layer by means of, for example, wet etching with etchant
Implementation Method 2
sequentially depositing metal materials in the recess on the base table formed by the resist mask to form the probe
Data Source
AI summary
In a probe manufacturing method, after a metal material for a probe is deposited on a base table, the probe can be detached from the base table relatively easily without damaging the probe. A recess corresponding to a flat surface shape of a probe is formed by a resist mask on a sacrificial layer on a base table, and a probe is formed by depositing a probe material in the recess. Thereafter, the resist mask is removed, and further the sacrificial layer is removed by an etching process with a part of the sacrificial layer remaining. For the purpose of forming an opening for control of the remaining part of the sacrificial layer in the etching process in the probe so as to let the opening pass through the probe in its plate thickness direction, a hole-forming portion for the opening is formed in the resist mask. Etching of the sacrificial layer in the etching process is promoted from an edge of the opening formed in the probe by this hole-forming portion.