Embedded Power Devices in PCB Driver Board Assemblies
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional driver board assemblies in motor-drive systems, such as those in hybrid and electric vehicles, face challenges in achieving compact designs while maintaining effective cooling and high power density due to the volume and inductance issues caused by power cartridges and liquid coolers.
Innovation Solution
The integration of power devices directly within a PCB substrate, combined with conductive layers that provide both electrical and thermal conduction, allowing for embedded cooling pathways to direct heat to cooling assemblies mounted on both surfaces of the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If power devices are mounted on driver board via pins extending from the board, then electrical connection is achieved, but volume profile increases and power density decreases
Solution Approach 1:
The patent merges the power devices with the PCB substrate by embedding them directly within the substrate layers, eliminating the need for separate mounting structures and extending pins. This integration reduces the overall volume profile while maintaining electrical connection functionality, thereby increasing power density without requiring additional external mounting space.
Solution Approach 2:
The patent transitions from a two-dimensional surface mounting approach to a three-dimensional embedded structure. Power devices are positioned within the internal layers of the PCB substrate rather than on the surface, utilizing the vertical dimension of the substrate to reduce the horizontal footprint and overall volume profile while maintaining electrical connectivity through conductive vias and traces.
2Volume of moving object
If power devices are embedded within PCB substrate, then volume profile decreases and power density increases, but thermal management complexity increases
Solution Approach 1:
The conductive layers within the PCB substrate serve dual functions: electrical connection and thermal conduction. The same metal traces and vias that provide electrical pathways between power devices and external connections also act as heat sinks and thermal conduction paths, eliminating the need for separate thermal management structures and reducing overall system complexity despite the embedded configuration.
Solution Approach 2:
The PCB substrate itself acts as an intermediary thermal management component. The substrate's internal conductive layers serve as thermal intermediaries, conducting heat away from embedded power devices through the substrate structure to external cooling mechanisms, thereby simplifying thermal management by integrating it into the existing substrate rather than requiring additional dedicated cooling components.
3Temperature
If conventional power cartridges are used with liquid coolers, then cooling effectiveness is maintained, but device footprint and volume increase
Solution Approach 1:
The patent combines the power device and cooling functions into a single integrated embedded structure. Power devices are embedded within the PCB substrate with conductive layers that simultaneously provide electrical connection and thermal conduction pathways. This integration eliminates the need for separate power cartridges and external liquid cooler assemblies, reducing device footprint while maintaining cooling effectiveness through the substrate's thermal conduction capabilities.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in more compact, high-power density driver board assemblies with reduced volume profiles and lower inductance, enabling efficient heat management and operation at high temperatures, thus supporting high-power applications like electric vehicles.
Implementation Method 1
thermally couple the one or more power devices to one or more cooling assemblies mounted to at least one of a first surface of the PCB substrate and a second surface of the PCB substrate opposite the first surface of the PCB substrate
Data Source
AI summary
A driver board assembly includes a printed circuit board (PCB) substrate, one or more power devices embedded within the PCB substrate, and a plurality of conductive layers arranged within the PCB substrate. The plurality of conductive layers are configured to electrically couple the one or more power devices to a current source and thermally couple the one or more power devices to one or more cooling assemblies mounted to at least one of a first surface of the PCB substrate and a second surface of the PCB substrate opposite the first surface of the PCB substrate.