Ablation Catheter Power Routing Circuit for Accurate Temperature Control
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Solution Overview
Problem
Existing endovascular thermal ablation systems face inaccuracies in temperature measurement due to heat dissipation in the power routing circuit, leading to potential underheating or overheating of the vein wall, which can compromise the effectiveness of vein occlusion and risk tissue damage.
Innovation Solution
Incorporation of a power routing circuit with transistors, such as MOSFETs, in parallel with diodes to reduce forward voltage drops, minimizing heat dissipation and improving temperature measurement accuracy at the distal end of the catheter.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If conventional power routing circuit components (diodes) are used, then the circuit can route power to heating elements, but forward voltage drops cause heat dissipation that compromises temperature measurement accuracy
Solution Approach 1:
The patent changes the electrical parameters of the power routing circuit by replacing diodes with MOSFETs that have significantly lower forward voltage drops. This parameter change reduces the voltage loss across the routing components, thereby reducing heat dissipation (P=VI) and improving temperature measurement accuracy at the distal end of the catheter.
Solution Approach 2:
The patent converts the harmful effect of forward voltage drops (which cause heat dissipation and measurement errors) into a benefit by using MOSFETs with such low resistance that the voltage drop becomes negligible. This transforms the power routing circuit from a source of measurement error into a near-ideal power delivery path.
2Reliability
If higher power is delivered to heating elements to ensure effective vein occlusion, then vein occlusion effectiveness improves, but heat dissipation in the power routing circuit increases causing temperature measurement inaccuracies
Solution Approach 1:
The patent changes the resistance parameter of the power routing circuit components from diode-level resistance to MOSFET-level resistance. This allows higher power delivery to heating elements for effective vein occlusion while minimizing the voltage drop and heat dissipation in the routing circuit, thereby maintaining accurate temperature measurements even at high power levels.
3Measurement precision
If power routing circuit components with lower forward voltage drops are used, then heat dissipation is reduced improving temperature measurement accuracy, but device complexity increases due to MOSFET circuit configuration
Solution Approach 1:
The patent substitutes diode-based power routing with MOSFET-based power routing. While MOSFETs require gate control signals, the overall system complexity is managed through integrated control circuitry that can simultaneously control multiple MOSFETs, enabling sophisticated power delivery patterns while maintaining low loss.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances temperature measurement accuracy by reducing heat dissipation in the handle, ensuring effective vein occlusion and minimizing tissue damage during thermal ablation procedures.
Implementation Method 1
power is delivered to heating elements located in the inserted portion of the catheter to apply the heat
Data Source
AI summary
In some examples, a power routing circuit of an endovascular ablation system may include components with reduced forward voltage drops in a handle of a thermal ablation catheter. The handle may also include a reference temperature sensor used for closed-loop temperature control. In some examples, power routing circuit may include transistors such as metal-oxide-semiconductor field-effect transistors (MOSFETs). In some examples, transistors may be coupled in parallel with diodes in the power routing circuit. In some examples, the diodes may be Schottky diodes. The reduction in forward voltage drops may reduce heat dissipation of the power routing circuit, which may reduce heating of the reference temperature sensor. Power losses in the handle that lead to reduced power in the distal heating elements may be reduced.


