Abrasive Cloth Polishing Layer Thermal Management
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Solution Overview
Problem
In the manufacturing of next-generation semiconductor devices, chemical mechanical polishing (CMP) processes face challenges in achieving high flatness due to miniaturization and increased layer stacking, leading to focus errors in exposure processes.
Innovation Solution
The use of an abrasive cloth with a polishing layer containing a polymer and a high-specific-heat, high-thermal-conductivity substance surrounded by the polymer, along with a low-thermal-conductivity substance, to manage frictional heat and maintain a low thermal diffusivity and high storage modulus, ensuring effective cooling and surface flatness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional polishing methods are used, then polishing can be performed, but temperature rise occurs leading to decrease in storage modulus and insufficient flatness
Solution Approach 1:
The polishing layer is constructed as a composite material comprising a polymer matrix with dispersed inorganic particles (such as silica or alumina). This composite structure provides both the mechanical properties needed for polishing and thermal management capabilities, where the inorganic particles help conduct heat away from the polishing interface while the polymer provides flexibility and polishing action.
Solution Approach 2:
The invention optimizes specific parameters of the polishing layer including thermal conductivity, specific heat capacity, and viscosity to control temperature rise. By adjusting the polymer molecular weight, crosslinking density, and inorganic particle concentration, the polishing layer achieves appropriate thermal diffusivity and storage modulus to prevent temperature-induced softening while maintaining polishing effectiveness.
2Ease of manufacture
If polishing is performed without thermal management, then the process is simple, but frictional heat causes temperature rise and loss of flatness control
Solution Approach 1:
The polishing layer composition is specifically designed with thermal parameters (thermal conductivity, specific heat) optimized to passively manage frictional heat generation. This allows effective thermal management to be achieved through material selection rather than complex active cooling systems, maintaining process simplicity while ensuring flatness control.
3Temperature
If the polishing layer has high thermal conductivity to dissipate heat, then temperature control improves, but storage modulus decreases compromising polishing performance
Solution Approach 1:
The composite structure allows decoupling of thermal and mechanical functions: the polymer matrix provides high storage modulus and structural integrity for effective polishing, while dispersed inorganic particles provide thermal conductivity for heat dissipation. This enables simultaneous optimization of both thermal management and mechanical performance.
Solution Approach 2:
The polishing layer exhibits spatial variation in composition and properties: the polymer-rich regions provide mechanical strength and storage modulus, while inorganic particle-rich regions provide thermal conductivity. This local differentiation allows the material to simultaneously satisfy conflicting requirements of high storage modulus and effective heat dissipation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach inhibits temperature rise within the abrasive cloth, preventing a decrease in storage modulus and ensuring high flatness of the polishing object's surface, thereby addressing the challenges of achieving precise flatness in CMP processes.
Implementation Method 1
The second substance is higher in specific heat and higher in thermal conductivity than the polymer in such a manner that the second substance is surrounded by the polymer
Implementation Method 2
The polishing layer has a fibrous first substance mixed therein or contains a second substance... to manage frictional heat and maintain a low thermal diffusivity
Data Source
AI summary
In accordance with an embodiment, a polishing method includes supplying slurry to a surface of a polishing layer including a polymer, and bringing a polishing object into contact with the polishing layer to polish the polishing object. The polishing layer has a fibrous first substance mixed therein or contains a second substance. The second substance is higher in specific heat and higher in thermal conductivity than the polymer in such a manner that the second substance is surrounded by the polymer.