Lapping Machines TRIZ Cases

Sensor-driven exhaust valves discharge bubbles during idle states, eliminating manual chemical handling risks while maintaining machine utilization.

Static pressure carrier guides eliminate mechanical friction and runout transmission to maintain high rotation precision during thin sheet grinding.

Contact angle measurement determines the optimal transition from dummy polishing to production mode, reducing wafer loss and stabilizing light point defects.

Composite polishing layer absorbs frictional heat to prevent temperature-induced softening and ensure surface flatness.

Positioned sensors detect wafer detachment in 80 microseconds, allowing the direct drive servo motor to decelerate the turntable before collision damage occurs.

A polishing head uses an annular partition wall to segment membrane zones and control gas pressure distribution.

Inclined grinding roller axes prevent resin layer sagging and wrinkles by correcting substrate moving direction.

Computer method generates reference spectra by associating measured optical data with platen rotation indices during polishing.

Laser displacement sensor monitors polishing pad surface profile during dresser oscillation to eliminate recipe tuning time and pad consumption.

A recessed detection window surrounded by a protrusion increases bonding strength to prevent slurry leakage and extend polishing pad lifespan.

Intersecting grooves expose the substrate layer to prevent collapse of protrusion portions while maintaining flatness during abrasion.

A film thickness signal processing apparatus corrects sensor data using measurement range size and discrete point values.

Stepped guide pins lower insertion force and prevent particle chipping in optical fiber connectors.

A swing arm positions a buff pad to clean substrates with controlled force, reducing edge defectivity and residue levels.

A silicon wafer polishing method uses graded rubber hardness pads to maintain oxide film integrity during double-side planarization.

A chemical mechanical polishing slurry uses an ILD suppressor to selectively remove cobalt while protecting low-K dielectric layers.

A polishing head uses a fluid chamber to switch between front and back surface reference polishing modes.

Carriers support flexible workpieces in a double-side grinding machine, preventing discontinuities and ensuring stable machining precision.

An interception filter and particle barrier within a chamber cover intercept foreign particles during dry polishing to maintain substrate processing precision.

Segmented land areas and inward-flowing channels in a rotating head reduce slurry waste while increasing particle density on the lapping plate surface.