Polishing Head Switching Between Front and Back Surface Polishing

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Solution Overview

Problem

Conventional polishing heads require different configurations for front surface reference polishing and back surface reference polishing, leading to increased downtime, cost, and complexity due to the need for multiple polishing heads or apparatuses. Additionally, the use of suction holes in conventional polishing heads can result in suction marks on the workpiece and contamination of the polishing head.

Innovation Solution

A single polishing head with a backing material, a workpiece pressurization plate, and a fluid chamber system that allows for switching between front surface reference polishing and back surface reference polishing by adjusting pressure and vacuum conditions, eliminating the need for suction holes and enabling the use of a single head for both methods.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional polishing heads use suction holes for fixing workpiece, then workpiece can be held during polishing, but suction marks are formed on workpiece and foreign matters are sucked into polishing head

Engineering Contradiction:
Improveworkpiece holding capabilityVSAvoidsuction marks and contamination
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The invention removes the suction holes from the polishing head structure entirely. Instead of using suction to hold the workpiece, the system employs a workpiece holding plate that contacts the workpiece surface directly, eliminating the source of suction marks and foreign matter contamination while maintaining workpiece holding capability during polishing operations

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The invention introduces a workpiece holding plate as an intermediary component between the polishing head and the workpiece. This plate serves as a mediator that provides mechanical support and holding force without requiring suction, thereby preventing both suction marks on the workpiece and contamination of the polishing head interior

Inventive Principle:
Principle #24Intermediary (Mediator)

2Manufacturing precision

If different polishing head configurations are used for front surface reference polishing and back surface reference polishing, then each polishing method can be optimized, but downtime increases and facility cost increases

Engineering Contradiction:
Improvepolishing method optimizationVSAvoidhead replacement downtime
Core Design Contradiction:
Manufacturing precisionVSLoss of time

Solution Approach 1:

The invention designs a universal polishing head structure that can perform both front surface reference polishing and back surface reference polishing using the same basic configuration. The workpiece holding plate and pressure adjustment mechanism enable the single head to adapt to different polishing methods, eliminating the need for multiple specialized heads and reducing replacement downtime

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The invention employs dynamic pressure adjustment capabilities that allow the polishing head to adapt its holding and pressing characteristics during operation. By adjusting the pressure in the fluid chamber, the system can optimize performance for different polishing methods (front surface reference or back surface reference) without physical reconfiguration, maintaining versatility while using a single head

Inventive Principle:
Principle #15Dynamics

3Adaptability or versatility

If multiple polishing heads are provided for different polishing methods, then polishing flexibility is improved, but facility cost and complexity increase

Engineering Contradiction:
Improvepolishing method flexibilityVSAvoidnumber of polishing heads
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The invention creates a single polishing head with universal functionality that can perform both front surface reference polishing and back surface reference polishing. The workpiece holding plate and adjustable pressure system provide the versatility needed to handle different polishing methods, eliminating the requirement for multiple specialized heads and thereby reducing facility complexity and cost

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution allows for efficient and cost-effective performance of both front and back surface reference polishing using a single polishing head, reducing downtime and facility complexity while preventing suction marks and contamination.

Implementation Method 1

control is performed to pressurize inside of the first fluid chamber to press the workpiece from above

Methodology Applied
Scientific EffectFluid pressure: Pressure Increase

Implementation Method 2

a soft and porous member is formed to provide suction holes through which the air is sucked for fixing the workpiece by the suction

Methodology Applied
Scientific EffectVacuum suction: Vacuum

Data Source

PatentUS20250073844A1Polishing head, polishing apparatus, and polishing method
Publication Date: 2025.03.06 FUJIKOSHI MACHINERY
  • US20250073844A1 patent drawing
  • US20250073844A1 patent drawing
  • US20250073844A1 patent drawing

AI summary

A polishing head includes a backing material including a suction surface facing an upper surface of a workpiece and an opposite pressing surface, a workpiece pressurization plate that is provided at a center portion of the pressing surface, and a first fluid chamber provided between the workpiece pressurization plate and the backing material. A control unit switches between front surface reference polishing in which inside of the first fluid chamber is pressurized to polish the workpiece in a state where the workpiece pressurization plate and the backing material are separated from each other, and back surface reference polishing in which the inside of the first fluid chamber is vacuumized or opened to the atmosphere and downward force is applied to the workpiece pressurization plate to polish the workpiece in a state where the workpiece pressurization plate and the backing material are in contact with each other.