Abrasive-Free CMP Fluid for Defect-Free Ceramic Polishing
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Solution Overview
Problem
Conventional chemical-mechanical polishing (CMP) methods require abrasive particles to achieve a defect-free surface on ceramic materials, which can lead to scratches and surface defects, and there is a need for an abrasive-free solution that maintains a suitable material removal rate.
Innovation Solution
A fluid composition comprising an oxidizing agent with an oxidation potential of 0.4 V or greater and a multivalent cation component, which alters the surface of the ceramic material and uses dynamic contact with a polishing pad to remove the altered layer without abrasive particles, achieving a relatively defect-free surface with controlled surface roughness and material removal rate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional polishing pads and slurries are used for polishing ceramic materials, then the polishing process can be performed, but the pads become contaminated with metal particles and organic decomposition products, leading to reduced polishing effectiveness and potential damage to the ceramic articles
Solution Approach 1:
The patent applies strong oxidizing agents (peracetic acid, hydrogen peroxide, ozone) to the polishing pad during the polishing process. These oxidants continuously clean the pad surface by oxidizing and removing metal particles and organic decomposition products, preventing pad contamination and maintaining consistent polishing performance throughout the polishing cycle.
2Object-affected harmful factors
If traditional oxidation methods using ozone or peracetic acid alone are used, then some cleaning effect is achieved, but the complexity of the chemical composition increases and control becomes more difficult
Solution Approach 1:
The patent uses a composite oxidizing fluid containing multiple oxidizing agents (peracetic acid and hydrogen peroxide, or ozone and hydrogen peroxide) working synergistically. This composite composition provides enhanced cleaning effectiveness while maintaining manageable chemical properties through the complementary actions of the different oxidants.
3Device complexity
If no oxidizing agent is used during polishing, then the process is simpler, but metal particles and organic decomposition products accumulate on the pad, reducing polishing precision and potentially damaging the ceramic articles
Solution Approach 1:
The oxidizing fluid acts as an intermediary substance between the polishing pad and the contaminated surfaces. It mediates the cleaning process by chemically reacting with and removing contaminants, thereby maintaining polishing precision without requiring complex mechanical cleaning mechanisms.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The abrasive-free fluid composition effectively polishes ceramic substrates to achieve a surface roughness of less than 10 angstroms and a material removal rate greater than 2.78e-11 m/s, with reduced scratches and improved surface quality compared to traditional CMP methods.
Implementation Method 1
The use of an oxidizing fluid during chemical-mechanical polishing removes metal particles and organic decomposition products from the polishing pad
Implementation Method 2
chemical-mechanical polishing, in which a slurry is applied to a polishing pad that is brought into contact with the article to be polished and rotated at a high rate of speed
Data Source
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AI summary
The present disclosure is directed to a fluid composition that can be used in chemical-mechanical polishing processes of inorganic material. The fluid composition can include at least one oxidizing agent and a multivalent cation component. Using the fluid composition during a chemical-mechanical polishing process can facilitate a relatively defect free material surface after polishing while achieving a suitable material removal rate.