Integrated AC Adapter Housing With Embedded Heat Sink
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Solution Overview
Problem
Conventional heat dissipation methods for AC power adapters with smaller volumes and higher power density face inefficiencies due to limited space for metal heat sinks and difficulties in controlling heat dissipation adhesive, leading to poor thermal management and potential stress on internal components.
Innovation Solution
An integrally formed heat dissipation housing with a metal heat sink embedded in a plastic housing, featuring a securing structure and an uneven surface for enhanced contact area, improves thermal conductivity and structural stability, allowing efficient heat transfer and homogenous temperature distribution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If metal heat sinks are attached around electronic assembly, then heat dissipation is improved, but assembly space becomes limited and heat dissipation efficiency deteriorates due to assembly gaps and thermal resistance
Solution Approach 1:
The patent merges the heat sink and housing into a single integrally formed component. The heat sink is formed as an integral part of the housing through injection molding, eliminating assembly gaps and reducing the number of parts. This integration allows the heat dissipation structure to occupy space more efficiently within the housing cavity while maintaining direct thermal contact between the heat sink and housing surfaces.
2Temperature
If heat dissipation adhesive is used to fill cavity, then heat dissipation is improved, but control of filling efficiency becomes difficult and stress on internal elements increases
Solution Approach 1:
The patent extracts the heat dissipation adhesive from the solution by eliminating its use entirely. Instead of filling the cavity with adhesive, the design relies on the integrally formed heat sink structure and air convection within the cavity for heat dissipation. This removes the complexity of controlling adhesive filling and eliminates the stress issues associated with adhesive solidification.
3Volume of stationary object
If AC adapter volume is reduced, then portability is improved, but heat dissipation space becomes limited and temperature control worsens
Solution Approach 1:
The patent applies local quality by creating an integrally formed heat sink with varying thickness and surface area distribution within the housing. The heat sink structure is designed with specific geometric features that concentrate heat dissipation capacity in critical areas while maintaining overall compactness. This allows efficient heat dissipation in a reduced volume by optimizing the local thermal properties of the heat sink structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides improved heat dissipation efficiency and structural stability by embedding a metal heat sink with a securing structure and uneven surface within the plastic housing, effectively managing heat in compact AC power adapters and preventing overheating.
Implementation Method 1
The heat generated by the internal element may be transferred to a plastic housing through the metal heat sink
Implementation Method 2
fill up all or most of the cavity in the AC adapter with heat dissipation adhesive having a good fluidity
Data Source
AI summary
The present disclosure provides a heat dissipation housing for an AC power adapter, including a housing and a heat sink disposed on an inner surface of the housing, and integrally formed with the housing. The heat sink includes an upper surface which is in close contact with the housing, and a lower surface which is exposed to the inside of the heat sink housing. The heat sink includes at least one securing structure which is formed by the upper surface of the heat sink.