Cooling/Ventilation/Heating Modifications TRIZ Cases

See how a movable louver bulkhead in server chassis reduces deflection during handling while en

See how dual heat-storage tanks, absorption chillers, and PCM cold storage recover waste heat f

See how a recovery device with air moving, water removal, and condensation units recaptures vap

See how a dual-circuit refrigeration design uses liquid cooling upstream and compressor cooling

See how a hybrid cooling module combines liquid coolant and refrigerant cycles to overcome radi

See how an integrated manifold control unit enables facility-grade water cooling in a single lo

See how a flexible cooling duct with automatic shut-off directs cold-aisle air to hot-aisle wor

Grouped adaptive vent tiles and fan settings balance server cooling demand, cutting excess airflow, energy use, and carbon emissions.

Temperature sensors in the battery management system start the generator during battery discharge so AC cooling runs without a DC-AC inverter.

A face-joined fixing plate inside the enclosure improves module mounting stability while simplifying cooling-channel heat dissipation.

Dual heat dissipation zones use bus bars to spread relay heat, combining radiation and convection for more effective junction box cooling.

A plastic snap-fit module holder secures semiconductor modules to a cooling plate, simplifying EV power electronics assembly while improving vibration resistance.

Power-demand pattern learning lets a coolant distribution unit anticipate AI load swings, reducing cooling component cycling and delay-driven stress.

A comb-teeth fin cover balances pressure loss across two IC regions so one fan can cool both components more evenly.

Lateral flow through finned compartments boosts coolant mixing and heat uptake while limiting pressure drop in electronic component cooling.

A trapped gas chamber at the high point of an inverter cooling loop compresses under coolant expansion to damp pressure pulsations and prevent leaks.

Lateral coolant flow through fin-formed compartments boosts mixing and heat uptake while avoiding the high pressure drop of meander channels.

Separate coupled channels circulate liquid and vapor to spread heat more evenly over large areas while lowering heat spreader cost.

A face-joined fixing plate replaces multiple posts to stabilize power conversion assembly mounting and transfer heat to a cooling flow channel.

Interlocking protrusions and recesses hold the base and cover during laser welding, preventing fluid path short circuits in cooling blocks.

Spring-loaded heat transfer in a routing member maintains cooling-member contact to restrain temperature rise under high current, vibration, and tolerances.

Thermal breaks and an aerofoil split heatsink fin sections to direct airflow and improve targeted cooling in fanless electronics.

Stacked chambers and sequential channels balance upstream and downstream cooling, cut pressure drop, and support modular replacement.

A confined impingement cooling loop integrates the pump and heat exchanger to cut tubing-related heat and pressure losses near electronic components.

A narrowed central inlet boosts refrigerant speed to cool the hottest semiconductor region first, reducing temperature imbalance and thermal runaway.

By lowering pump RPM during coolant valve mode changes, this EV cooling case stabilizes flow paths and cuts noise and vibration.

A welded or bonded fixing plate stabilizes the power conversion assembly while a flow channel removes heat from high-power components.

Vacuum packing drives uncured resin to the sheet surface, stabilizing tack force for secure mounting without sacrificing thermal resistance.

Parallel vapor paths and capillary liquid return improve refrigerant circulation between heat receiver and condenser in a compact cooling structure.

Housing pressure on fin edges seals adjacent microchannels, stopping coolant bypass while enabling denser fins and compact heat transfer.

A stacked two-housing layout uses one cooling structure to dissipate heat from both vehicle assistance processors while simplifying module exchange.

Elastic pressure blocks maintain thermal contact without rigid-force damage, simplifying assembly and improving insulation in vehicle electronics.

A lug-mounted torsional spring compresses the thermal gasket evenly, improving die cooling while freeing PCB trace routing space.

Jet impingement liquid cooling and a heat spreader raise server heat dissipation capacity while lowering data center air conditioning load.

Aerogel inside the rearview mirror head limits heat and vibration transfer from electronics, keeping the casing cooler and quieter.

Open conduits route heat pipes through the housing wall to cool power electronics without sealed cooling channels, easing assembly and sealing.

A support member fixes the cooling tube so attachment and detachment loads do not stress the cooling joint or housing mount.

An insulated discharge path and liquid separation break the water conduction route between a charged drain pan and grounded piping.

A shared liquid channel cools both switches and capacitors on the PCB, cutting heat rise while keeping inductive loops short.

An elastic compensating element and slidable contact improve plug-in module heat transfer despite uneven heat sink surfaces and wider tolerances.

A copper center stiffener with DBC ceramic plates conducts heat from enclosed power dies where airflow cooling is not possible.

Separate conductive inserts link PCB heat sources to the cover, improving hotspot cooling while preserving watertight sealing.

Multiple vapour chambers spread heat from power electronic components to improve cooling efficiency, widen operating range, and support more compact modules.

A leak sensor and electromagnet disengage the server fluid connector to stop coolant flow quickly without added valves or pump complexity.

Interwoven fiber bundles conduct heat between plates without a rigid interface, maintaining thermal transfer under vibration and movement.

A deformable bellows and pressure-release vent regulate tank airspace pressure and reduce coolant vapor loss in two-phase immersion cooling.

Routing fan motor wiring through conductive holes and fins improves heat dissipation while boosting shielding in electrical apparatus cooling.

A sliced resin composite aligns thermally conductive fillers through the sheet thickness to lower contact thermal resistance on uneven adherends.

An embedded metal heat sink molded into the adapter housing improves heat transfer, saves assembly space, and avoids adhesive filling stress.

A flexible bellows with integrated relief vents regulates tank pressure and captures coolant vapor during overpressure in two-phase immersion cooling.

A metal heat diffuser embedded in a resin flow path spreads heat to resin fins, improving cooling while avoiding costly all-metal heat sinks.

A heat-sink cover clamps the heat sink into the housing, cutting screw-related complexity, saving space, and preserving heat removal.

Vacuum packing drives uniform binder resin exudation, giving heat transfer sheets stable tack and secure mounting without harming thermal performance.

Vacuum-controlled two-phase dielectric immersion cooling lowers boiling point, condenses vapor, and limits fluid loss and contamination.

Friction welding replaces brazing flux in a liquid cooling plate, preventing gas generation, deformation, and damage to mounted components.

Predictive airflow control balances cooling units, containment leakage, and IT load to prevent CPU throttling and cut data center power use.

A graphene-copper sandwich layer spreads and conducts heat quickly, helping CPUs and GPUs cool faster under high heat flux.

Heating rods keep dielectric fluid warm at startup, reducing vapor pressure spikes in two-phase immersion cooling for computer components.

Cuts two-phase immersion cooling cost by switching to a high-boiling-point fluid and rerouting cooled return flow into the reservoir.

Converts costly two-phase immersion cooling to a lower-cost one-phase layout by rerouting cooled high-boiling fluid into the reservoir.

Parallel CDU flow paths and standby pre-cooling keep immersion-cooled electronics running during pump or filter maintenance.

Multiple blade groups with matched inlets cut refrigerant pressure loss, lower pump power, and keep cooling more uniform.

Directed airflow cools multiple housing surfaces to improve imaging heat dissipation while reducing ineffective fan circulation.

A vacuum pump and atomized working fluid create phase-change server cooling, then condense and recycle vapor for stable heat removal.

Acoustic waves vibrate immersion coolant to thin the boundary layer and boost rack cooling without bulky piping or large pumps.

Two shared flow circuits and thermally coupled manifolds cool multiple aircraft power modules while reducing cooling weight and complexity.

Lowering tank pressure with a sucking pump reduces coolant boiling point, enabling low-temperature chipset cooling with simpler integrated heat dissipation.

A spring-biased plunger closes the datacenter cooling manifold on power loss, containing leaks and protecting adjacent nodes.

Uneven liquid temperatures limit immersion cooling; submerged air diffusers create bubbles that circulate coolant around heat sources for more uniform cooling.