Power Module Cooling with Multiple Vapour Chambers
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Solution Overview
Problem
Current cooling methods for power semiconductor modules are inefficient, leading to heat transfer limitations that restrict the operating range and compactness of these devices.
Innovation Solution
The use of multiple vapour chambers to effectively transfer and spread heat from power electronic components to a cooling element, even out temperatures, and enhance heat transfer properties, allowing for improved utilization of the operating range and reduced physical size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If conventional cooling methods (heat sink or single vapour chamber) are used, then the structure is simple, but the heat transfer efficiency is insufficient
Solution Approach 1:
The cooling system is divided into multiple vapour chambers (first vapour chamber and second vapour chamber) instead of using a single cooling element. Each vapour chamber independently manages heat from specific power electronic components, enabling more efficient heat distribution and transfer to the cooling medium.
2Adaptability or versatility
If the cooling efficiency is increased to expand operating range, then more vapour chambers are needed, but the device complexity increases
Solution Approach 1:
Multiple vapour chambers are merged into a single integrated cooling system where the first and second vapour chambers work together with shared thermal interface material and common cooling medium flow paths. This combination achieves enhanced cooling capacity and expanded operating range while avoiding the complexity of completely separate cooling systems.
3Volume of moving object
If heat transfer efficiency is improved, then the physical size can be reduced, but the manufacturing complexity increases
Solution Approach 1:
The thermal interface material parameters are optimized by applying thermal conductive grease between the power electronic components and first vapour chamber, and between the second vapour chamber and cooling medium. This parameter optimization enhances heat transfer efficiency, allowing compact device design while maintaining manufacturability through standard thermal interface materials.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables more complete utilization of the operating range of power electronic components, reduces physical size, and enhances heat transfer efficiency, addressing the limitations of existing cooling methods.
Implementation Method 1
multiple of vapour chambers arranged to transfer the heat generated by the multiple of power electronic components
Implementation Method 2
The vapour chambers of the invention are arranged such that the heat is transferred from one vapour chamber to another vapour chamber
Data Source
AI summary
A power electronic assembly includes a power electronic module having multiple of power electronic components and a cooling element. The cooling element is attached to a surface of the power electronic module and is arranged to transfer heat from the power electronic assembly to a cooling medium, wherein the assembly comprises multiple of vapour chambers arranged to transfer the heat generated by the multiple of power electronic components.