Cooling Structure With Shielded Fan Wiring for Better Heat Dissipation
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Solution Overview
Problem
The existing cooling structure for electrical apparatuses, which relies primarily on a fan for heat dissipation, lacks enhanced heat dissipation and shielding performance, particularly due to the exposure of the harness connected to the fan motor.
Innovation Solution
A cooling structure incorporating a base with heat dissipation fins and a protrusion made of an electrically conductive material, a lid member with an air inlet, and a fan mechanism that generates airflow, where the conductive wire is partially or entirely surrounded by conductive components to enhance both heat dissipation and shielding performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If only a fan mechanism is provided for heat dissipation, then the device complexity is low, but the heat dissipation performance is insufficient
Solution Approach 1:
The patent combines the heat dissipation function and electromagnetic shielding function into a single integrated cooling structure. The conductive wire serving as both electrical connection and shielding element merges two functions into one component, reducing overall device complexity while improving both heat dissipation and shielding performance simultaneously
Solution Approach 2:
The cooling structure is designed to perform multiple functions: heat dissipation through fins and airflow, electromagnetic shielding through conductive components, and structural support. This multi-functionality allows the system to achieve enhanced heat dissipation performance without proportionally increasing device complexity
2Reliability
If the harness is entirely exposed inside the fan cover, then the ease of manufacture is high, but the shielding performance is insufficient
Solution Approach 1:
The harness is integrated with the cooling structure such that the conductive wire serves dual purposes: electrical connection to the fan motor and electromagnetic shielding. This merging of functions improves shielding performance while the integrated design actually simplifies assembly by reducing the number of separate components
Solution Approach 2:
The conductive wire is positioned within the cooling structure, nested between the fan cover and the heat dissipation fins. This nesting arrangement provides shielding protection while maintaining ease of manufacture through a compact, integrated design that requires minimal additional assembly steps
3Productivity
If heat dissipation fins are added to enhance heat dissipation, then the heat dissipation performance is improved, but the device complexity increases
Solution Approach 1:
The heat dissipation fins are integrated directly into the cooling structure base, merging the heat dissipation function with the structural support function. This integration allows enhanced heat dissipation performance to be achieved without proportionally increasing device complexity, as the fins serve both thermal and structural purposes
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The configuration significantly improves heat dissipation and shielding performance by utilizing the protrusion and heat dissipation fins to direct airflow and shield electrical components, reducing noise and enhancing the structural integrity of the cooling system.
Implementation Method 1
a fan mechanism that is driven to rotate and thereby generate an airflow with its upstream side at the air inlet and its downstream side at the flow path
Implementation Method 2
releases, through the heat dissipation surface and the plurality of heat dissipation fins, heat received from a heat source
Implementation Method 3
The protrusion includes a first through hole. The base includes a second through hole communicating with the first through hole. The conductive wire includes a first portion connected to the driving portion and disposed between the lid member and the main body, and a second portion continuing from the first portion and inserted in the first through hole and the second through hole
Data Source
AI summary
A cooling structure includes: a main body including a base, and heat dissipation fins and a protrusion that protrude from a heat dissipation surface; a lid member disposed to cover the protrusion and the fins and form a flow path; and a fan mechanism. The fan mechanism includes a vane portion, a driving portion that rotates the vane portion, and a conductive wire for supplying electric power to the driving portion. The protrusion includes a first through hole, and the base includes a second through hole communicating with the first through hole. The conductive wire includes a first portion connected to the driving portion and disposed between the lid member and the main body, and a second portion continuing from the first portion and inserted in the first through hole and the second through hole. The cooling structure enables enhancement of the heat dissipation and shielding performance.