Power Supply Enclosure With Fixing Plate Liquid Cooling

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Solution Overview

Problem

Conventional methods for heat dissipation in high-power switch mode power supplies, such as those used in vehicle-mounted chargers, face challenges due to increased power density, where air cooling and natural heat dissipation are insufficient. Additionally, forming fixing posts within deep-drawn enclosures is complex and unstable, while die casting increases costs and process complexity.

Innovation Solution

A power supply enclosure with a housing and a fixing plate, where the fixing plate is securely connected to the housing using welding or adhesive bonding, providing a stable connection area for fixing the power supply conversion functional assembly. This design allows for efficient heat dissipation using a cooling fluid in the flow channel and simplifies the assembly process compared to die casting.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If a water channel is disposed in a power supply enclosure for heat dissipation, then heat dissipation efficiency is improved, but the complexity of forming the enclosure increases

Engineering Contradiction:
Improveheat dissipation efficiencyVSAvoidenclosure formation complexity
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

The patent merges the water channel structure with the power supply enclosure by integrally forming both components through die casting. The enclosure and water channel form a unified structure that simplifies manufacturing while maintaining effective heat dissipation functionality.

Inventive Principle:
Principle #5Merging (Combining)

2Stability of the object's composition

If fixing posts are separately fixed in a deep-drawn enclosure, then component fixation is achieved, but process time increases and connection stability deteriorates

Engineering Contradiction:
Improveconnection stabilityVSAvoidassembly time
Core Design Contradiction:
Stability of the object's compositionVSLoss of time

Solution Approach 1:

The patent combines the fixing post function with the water channel structure by integrally forming both through die casting. This eliminates separate assembly steps for fixing posts while ensuring stable connection between components and the enclosure.

Inventive Principle:
Principle #5Merging (Combining)

3Ease of manufacture

If die casting process is used to form the enclosure with fixing posts, then fixing posts can be integrally formed, but die costs and process complexity increase

Engineering Contradiction:
Improvefixing post integrationVSAvoiddie casting complexity
Core Design Contradiction:
Ease of manufactureVSDevice complexity

Solution Approach 1:

The patent merges multiple functions (enclosure formation, water channel creation, and fixing post integration) into a single die casting process. This allows all components to be formed integrally in one step, simplifying the overall manufacturing process despite the complexity of the die design.

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution provides stable and efficient heat dissipation for high-power components, improving connection stability and reducing assembly complexity and costs. It effectively addresses the limitations of conventional methods by utilizing a securely fixed fixing plate and a cooling fluid-based heat dissipation system.

Implementation Method 1

heat dissipation on a heat generating component in the power supply conversion functional assembly by using a cooling fluid in the first flow channel

Methodology Applied
Scientific EffectConvection: Convection

Implementation Method 2

heat dissipation on a heat generating component in the power supply conversion functional assembly by using a cooling fluid in the first flow channel

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS12308734B2Power supply enclosure, power supply conversion apparatus, and electronic device
Publication Date: 2025.05.20 HUAWEI DIGITAL POWER TECH CO LTD
  • US12308734B2 patent drawing
  • US12308734B2 patent drawing
  • US12308734B2 patent drawing

AI summary

A power supply enclosure is disclosed in this application, the power supply enclosure includes a housing and a fixing plate. The housing has an accommodation cavity, and a first flow channel is disposed in the housing. The fixing plate is located in the accommodation cavity, at least a part of a surface of the fixing plate that faces the housing is fixedly connected to at least a part of an inner surface of the housing, and the fixing plate is configured to fix a power supply conversion functional assembly, so as to perform heat dissipation on a heat generating component in the power supply conversion functional assembly by using a cooling fluid in the first flow channel.