Stacked Processor Housing With Shared Cooling for Vehicle Assistance
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Solution Overview
Problem
Existing electronic computing devices in motor vehicles face challenges in efficiently cooling multiple processor devices and simplifying the exchange of processor devices, which can lead to reduced computing power and potential device failure due to overheating.
Innovation Solution
The proposed solution involves an electronic computing device with a stacked housing configuration, where a first processor device is housed in a first internal space and a second processor device is housed in a separate second internal space, both stacked vertically with a cooling device formed between the outer walls of the housings, allowing both processors to be cooled efficiently by a single cooling device.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If multiple processor devices are stacked to increase computing power, then the computing power increases, but the heat dissipation becomes more difficult and device complexity increases
Solution Approach 1:
The patent transitions from horizontal arrangement to vertical stacking of processor devices, utilizing the third dimension (height) to increase computing power while maintaining a compact footprint. The cooling device is integrated between the stacked processors, with cooling channels extending vertically to dissipate heat from multiple processors simultaneously, effectively managing thermal loads in the vertical dimension.
Solution Approach 2:
The patent combines multiple processor devices into a single stacked assembly that shares a common cooling device. The cooling device is merged with the housing structure and integrates cooling channels that service multiple processors, reducing the total number of separate cooling systems needed and simplifying the overall thermal management architecture.
2Power
If multiple processor devices are stacked to increase computing power, then the computing power increases, but the device complexity increases
Solution Approach 1:
The housing structure serves multiple functions simultaneously: it provides mechanical support for the stacked processors, acts as a thermal management system through integrated cooling channels, and serves as a protective enclosure. The cooling device is multi-functional, providing cooling to multiple processors through a single unified system rather than separate cooling solutions for each processor.
Solution Approach 2:
The patent segments the electronic computing device into modular components: a housing module, a cooling device module, and processor modules that can be stacked in different configurations. This segmentation allows for flexible assembly and maintenance while managing complexity through standardized interfaces and modular design principles.
3Volume of moving object
If processor devices are integrated into a single housing to save space, then installation space is reduced, but the exchange and maintenance of processor devices becomes more difficult
Solution Approach 1:
The patent employs a dynamic design where the housing can be opened or disassembled to access the stacked processor devices. The cooling device is designed with accessible interfaces that allow processor removal without requiring complete disassembly of the entire system, enabling maintenance while maintaining a compact form factor during operation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables efficient cooling of both processor devices, increases computing power, and allows for simple exchange of the second processor device without replacing the entire electronic computing device, thereby enhancing operational reliability and flexibility.
Implementation Method 1
the processor devices generate heat at least in the operation... the cooling device is formed for cooling the processor devices... air cooling systems or fluidic cooling systems are also already known from the prior art, which can dissipate the generated heat from the processor device
Data Source
AI summary
An electronic computing device for an assistance system of a motor vehicle is disclosed. The device includes a first housing. A first processor device of the assistance system is arranged in a first internal space of the first housing and generates heat during operation. The device also includes a cooling device for cooling the first processor device. The cooling device is formed on a first outer wall of the first housing. A separate second housing with a second internal space is arranged stacked on the first housing viewed along a vertical direction of the electronic computing device. A second processor device of the assistance system is arranged in the second internal space. The second processor device generates heat during operation. A columnar structure of the cooling device is formed on a first outer side of the first outer wall.