Vacuum Phase-Change Cooling Tank for Low-Temperature Chipset Heat Dissipation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing immersion-type phase-change liquid cooling technologies face challenges in complexity, integration level, vacuum degree, and lack of visualization, limiting their ability to effectively dissipate heat at low temperatures due to high boiling points and system complexity.
Innovation Solution
A heat dissipation apparatus with a sealed liquid cooling tank, phase-change working medium, and a sucking pump that reduces air pressure to control the boiling point, combined with a light transmission structure for liquid level observation and a radiator system for efficient heat exchange.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If immersion-type phase-change liquid cooling is used, then heat transfer efficiency is improved, but system temperature depends on boiling point making low-temperature heat dissipation impossible
Solution Approach 1:
The patent changes the physical parameter of atmospheric pressure to control the boiling point of the phase-change cooling liquid. By reducing atmospheric pressure, the boiling point decreases, enabling the system to operate at lower temperatures while maintaining efficient phase-change heat transfer. This resolves the contradiction by making system temperature adjustable rather than fixed.
Solution Approach 2:
The patent utilizes the phase transition of the cooling liquid from liquid to gas and back, which occurs at different temperatures depending on pressure. By controlling pressure, the phase transition temperature is adjusted to match the heat dissipation requirements, maintaining high heat transfer efficiency at low operating temperatures.
2Temperature
If atmospheric pressure is reduced to lower boiling point, then low-temperature heat dissipation is enabled, but system complexity increases
Solution Approach 1:
The patent employs a self-adjusting pressure control mechanism where the phase-change process itself helps regulate the pressure within the sealed container. The system automatically maintains the pressure level needed for the desired boiling point without requiring complex external pressure control systems, reducing overall system complexity.
Solution Approach 2:
The patent introduces a pressure control mechanism as an intermediary between the heat dissipation requirements and the phase-change process. This intermediary component simplifies the control architecture by providing a direct link between temperature requirements and pressure adjustment, avoiding the need for complex multi-stage control systems.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables effective heat dissipation of heating devices at low rated temperatures by reducing the boiling point of the phase-change working medium, simplifying system complexity, and enhancing visualization and integration.
Implementation Method 1
when the sucking pump extracts gas in the liquid cooling tank, air pressure in the liquid cooling tank is reduced from a first value to a second value
Implementation Method 2
the second value of the air pressure corresponds to a boiling point of the phase-change working medium
Implementation Method 3
In a process of heat transfer, a cooling liquid absorbs and releases heat, resulting in phase change, usually accompanied with a small amount of overcooling or overheating, but heat transfer mainly depends on latent heat of phase-change of substances
Implementation Method 4
heat transfer mainly depends on latent heat of phase-change of substances
Implementation Method 5
the radiator is provided on an upper surface of the liquid cooling tank, and an interior of the radiator is communicated with the interior of the liquid cooling tank
Implementation Method 6
the radiator includes a harmonica tube, and the harmonica tube is a micro-ribbed structure; the harmonica tube is provided on the upper surface of the liquid cooling tank and is communicated with the interior of the liquid cooling tank at the upper surface thereof, and the harmonica tube is used for cooling the phase-change working medium
Data Source
AI summary
The present disclosure provides a heat dissipation apparatus for cooling a chipset, including: a sealed liquid cooling tank; a phase-change working medium infused in an interior of the liquid cooling tank; an exhaust port provided in an outer wall of the liquid cooling tank, and the liquid cooling tank is connectable with a sucking pump through the exhaust port; when the sucking pump extracts gas in the liquid cooling tank, air pressure in the liquid cooling tank is reduced from a first value to a second value. The heat dissipation apparatus disclosed in the present application can realize effective heat dissipation of heating devices at a low rated temperature.