Thermal Insert Assembly for PCB Hotspot Cooling and Sealing
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Solution Overview
Problem
Existing electronic units for automotive electronics face challenges in efficiently dissipating heat from high-power devices, particularly when complex structures like water cooling systems are not sufficient, and thermal conductive elements are not in direct contact with heat sources.
Innovation Solution
Incorporating thermally conductive insert elements with blind cavities and distinct thermal conductivities, made of materials like copper alloy and silver, which are fixed to the top cover using watertight means such as brazed joints or adhesive paste, ensuring direct thermal contact with heating sources and enhanced heat dissipation through a liquid coolant cold plate system.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If complex water cooling systems are implemented to handle high heat fluxes, then heat dissipation capability is improved, but device complexity and manufacturing cost increase
Solution Approach 1:
The cooling system is segmented into modular thermally conductive insert elements that can be independently installed in specific locations on the printed circuit board where heat sources are present. Each insert element is a separate component with standardized dimensions, allowing selective placement rather than implementing a complex integrated water cooling system across the entire device.
Solution Approach 2:
Thermally conductive insert elements are placed locally at specific positions on the printed circuit board corresponding to heat-generating components. This localized approach provides targeted heat dissipation where needed without the complexity of a comprehensive water cooling system, allowing the housing material to remain simple die-cast material.
2Temperature
If thermal conductive elements are used between electronic components and housing, then heat dissipation is improved, but watertight sealing becomes difficult to maintain
Solution Approach 1:
A sealing element acts as an intermediary component between the thermally conductive insert element and the housing. This sealing element is received within a recess of the housing and creates a watertight seal while allowing the thermally conductive insert element to pass through, thus maintaining both heat dissipation functionality and watertight sealing.
Solution Approach 2:
The sealing element is nested within a recess of the housing, and the thermally conductive insert element passes through the sealing element. This nested arrangement allows the sealing function to be integrated into the housing structure while accommodating the thermal conduction path.
3Temperature
If thermally conductive insert elements are integrated into the housing, then heat dissipation is improved, but manufacturing precision requirements increase
Solution Approach 1:
The thermally conductive insert elements are segmented as separate, removable components rather than being integrally formed with the housing. This segmentation allows for standardized manufacturing of both the housing and insert elements independently, reducing the precision requirements for integrating thermal conduction paths into the housing structure.
Solution Approach 2:
The thermally conductive insert elements are designed as universal components with standardized dimensions and mounting features that can be applied to various housing configurations. This universality simplifies manufacturing by using standardized parts rather than custom-integrated solutions requiring high precision.
4Ease of manufacture
If die casted housing with pedestals is used for heat dissipation, then manufacturing simplicity is maintained, but heat dissipation efficiency is insufficient for high heat fluxes
Solution Approach 1:
The system uses composite construction combining the die-cast housing material with separate thermally conductive insert elements made of materials having higher thermal conductivity. This composite approach maintains the manufacturing simplicity of die-casting for the housing while adding high-performance thermal conduction where needed through the insert elements.
Solution Approach 2:
The thermal conduction function is segmented into separate insert elements that can be optimally designed for thermal performance without compromising the housing manufacturing process. The housing remains a simple die-cast structure, while the insert elements provide enhanced heat dissipation capability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly improves heat dissipation by providing higher thermal conductivity than standard housing materials, maintaining watertight seals, and optimizing heat transfer without protruding flanges, effectively managing high heat fluxes in electronic units.
Implementation Method 1
a bottom wall extremity in thermal contact with a heating source element arranged on a printed circuit board
Implementation Method 2
liquid coolant wall guides configured to convey the coolant liquid from the coolant liquid inlet to the first thermally conductive insert element and from the first thermally conductive insert element to the coolant liquid outlet
Data Source
Figure 1~2
Figure 3~4
Figure 5~6
AI summary
Electronic unit (10) comprises an housing (12) comprising a top cover (18); a printed circuit board (16) mounted inside the housing (12) and comprising at least a first heating source element (24) on the top layer of the printed circuit board (16); the top cover (18) comprises at least a first opening (20); the electronic unit (10) comprises at least a first thermally conductive insert element (28) distinct from the housing (12) and extending from its top extremity arranged around the first opening (20), to its bottom extremity in thermal contact with the first heating source element (24) such that heating dissipation of the first heating source element (24) is allowed; fixing means (42) configured to entirely fix the top extremity of the first thermally conductive insert element (28) with the top cover (18) around the first opening (20).