Hybrid Server Cooling with Jet Impingement Heat Removal
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Solution Overview
Problem
Conventional cooling systems for servers in data centers are limited by the extent of air conditioning available, which restricts the amount of heat that can be removed, thereby limiting the performance of high-power server components.
Innovation Solution
A cooling system that includes a heat spreader thermally coupled to heat-generating electronic devices and a heat removal device with jet impingement features, utilizing a primary cooling fluid and a secondary cooling fluid in a heat transfer relationship within a heat exchanger to enhance heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional air cooling systems are used, then the server components can operate, but the heat dissipation capacity is limited by air conditioning availability
Solution Approach 1:
The cooling system is segmented into two independent loops: a primary liquid cooling loop that directly removes heat from high-power components via heat spreaders and heat exchangers, and a secondary air cooling loop that handles peripheral components. This segmentation allows each loop to be optimized for its specific cooling requirements, enabling high heat dissipation capacity without proportionally increasing air conditioning load.
Solution Approach 2:
The patent employs liquid cooling (hydraulics) through heat spreaders and heat exchangers to efficiently transfer heat from high-power electronic components. The primary cooling fluid circulates through the system, absorbing heat and transferring it to the heat exchanger, where it is dissipated to the secondary cooling fluid. This hydraulic approach provides superior heat dissipation capacity compared to conventional air cooling alone.
2Power
If higher performance server components are used, then processing power increases, but heat dissipation requirements increase beyond conventional cooling capabilities
Solution Approach 1:
The cooling system applies local quality by providing enhanced liquid cooling specifically at locations of high heat generation (high-power server components via heat spreaders), while peripheral components continue to use conventional air cooling. This localized approach matches the cooling intensity to the heat generation intensity, enabling high-performance components to operate without uniformly increasing cooling requirements across the entire server.
Solution Approach 2:
Heat spreaders and heat exchangers serve as intermediaries between high-power electronic components and the primary cooling fluid. The heat spreaders conduct heat away from component surfaces, and the heat exchangers transfer thermal energy from the primary cooling fluid to the secondary cooling fluid. These intermediary devices enable efficient heat removal from high-power components that would otherwise be impossible with direct air cooling alone.
3Loss of energy
If air flow cooling is used, then components can be cooled, but the amount of heat removable is limited by air conditioning availability
Solution Approach 1:
The cooling system achieves universality by designing a hybrid architecture that can handle both high-density heat loads (via primary liquid cooling) and lower-density heat loads (via secondary air cooling) within a single integrated system. The heat exchanger serves multiple functions: transferring heat from the primary to secondary cooling loops, and potentially serving as a thermal management interface for different operating conditions. This multi-functional design improves overall heat removal efficiency while maintaining adaptability to various cooling scenarios.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively increases the heat dissipation capacity, allowing for higher performance operation of server components while reducing the air conditioning load and costs associated with cooling data centers.
Implementation Method 1
a heat spreader thermally coupled to the at least one heat-generating electronic device and a heat removal device having a surface that is thermally coupled to the at least one heat-generating electronic device via the heat spreader
Implementation Method 2
The at least one jet impingement feature is positioned to direct a primary cooling fluid toward the surface that is thermally coupled to the at least one heat-generating electronic device
Implementation Method 3
The primary cooling fluid and a secondary cooling fluid may be arranged in a heat transfer relationship within the at least one heat exchanger
Data Source
Figure 1
Figure 2
Figure 3A~3B
AI summary
A cooling system (100) for cooling an assembly including at least one heat-generating electronic device (50) includes a heat spreader (120) thermally coupled to the at least one heat-generating electronic device (50) and a heat removal device (102) having a surface (128) that is thermally coupled to the at least one heat-generating electronic device (50) via the heat spreader (120). The heat removal device (102) includes an inlet area (106) and at least one jet impingement feature (110) fluidly coupled to the inlet area (106). The at least one jet impingement feature (110) is positioned to direct a primary cooling fluid (C1) toward the surface (128) that is thermally coupled to the at least one heat-generating electronic device (50).