Routing Member Spring Structure for Electronic Component Cooling

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Solution Overview

Problem

The increase in capacity of battery packs in vehicles leads to excessive temperature rise in electronic components and routing members due to increased current flow, necessitating a measure to restrain this rise.

Innovation Solution

An electronic component unit with a routing member that includes a holding member, a heat transferring portion, and spring portions to press against a cooling member, utilizing spring force to maintain contact and transfer heat efficiently, thereby restraining temperature rise.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Use of energy by moving object

If the capacity of the battery pack is increased to extend driving distance, then the energy storage capability is improved, but the current flow increases causing excessive temperature rise in electronic components and routing members

Engineering Contradiction:
Improveenergy storage capabilityVSAvoidtemperature rise
Core Design Contradiction:
Use of energy by moving objectVSTemperature

Solution Approach 1:

The routing member is divided into multiple segments including a heat transferring portion that contacts the cooling member, spring portions for applying pressure, and held portions for electrical connection. This segmentation allows the routing member to simultaneously conduct electricity and transfer heat to the cooling member, effectively managing temperature rise while maintaining electrical functionality.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

A cooling member is introduced as an intermediary between the routing member and the environment. The heat transferring portion of the routing member contacts this cooling member, which acts as a mediator to absorb and dissipate heat generated by high current flow, thereby preventing excessive temperature rise in the electronic component unit.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Temperature

If additional cooling components are added to restrain temperature rise, then the temperature control is improved, but the device complexity increases

Engineering Contradiction:
Improvetemperature controlVSAvoiddevice complexity
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

The routing member is merged with cooling functionality by integrating a heat transferring portion that directly contacts the cooling member. This merging eliminates the need for separate cooling components while maintaining effective heat dissipation, thereby improving temperature control without increasing device complexity.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The routing member is designed to perform multiple functions simultaneously: electrical connection through held portions, heat transfer through the heat transferring portion, and mechanical pressure application through spring portions. This multi-functionality reduces the need for additional components, maintaining simplicity while achieving effective temperature control.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Manufacturing precision

If rigid connection structures are used for assembly, then the manufacturing precision is improved, but the adaptability to vibrations and assembly tolerances deteriorates

Engineering Contradiction:
Improveassembly precisionVSAvoidadaptability to vibrations
Core Design Contradiction:
Manufacturing precisionVSAdaptability or versatility

Solution Approach 1:

Spring portions are incorporated into the routing member to provide elastic deformation capability. These spring portions can dynamically adjust to vibrations and assembly tolerances while maintaining contact pressure between the heat transferring portion and the cooling member, thereby maintaining both manufacturing precision and adaptability to dynamic conditions.

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The spring portions act as flexible elements within the routing member structure, allowing elastic deformation to accommodate vibrations and assembly variations. This flexibility ensures continuous contact between the heat transferring portion and the cooling member without requiring rigid, precision-machined connections.

Inventive Principle:
Principle #30Flexible shells and thin films

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively prevents excessive temperature rise in electronic components and routing members by constant heat transfer to the cooling member, reducing the need for additional components and maintaining cooling performance despite vibrations and assembly tolerances.

Implementation Method 1

a first spring portion coupling the first held portion to the heat transferring portion and pressing the heat transferring portion against the cooling member with spring force generated between the first held portion and the heat transferring portion

Methodology Applied
Scientific EffectSpring force: Spring

Implementation Method 2

the pressing structure includes an elastically deforming portion provided as part of the holding member and pressing the pressure portion against the heat transferring portion with force reacting to elastic deformation

Methodology Applied
Scientific EffectElastic deformation: Elasticity

Implementation Method 3

a heat transferring portion capable of transferring heat to the cooling member in contact

Methodology Applied
Scientific EffectHeat transfer: Conduction (thermal)

Data Source

PatentUS12376266B2Electronic component unit
Publication Date: 2025.07.29 YAZAKI CORP
  • US12376266B2 patent drawing
  • US12376266B2 patent drawing
  • US12376266B2 patent drawing

AI summary

Included are an electronic component, an insulating holding member holding the electronic component, a conductive routing member provided with an electrical connection portion, and a pressing structure pressing the routing member against a cooling member for cooling. The routing member includes a first held portion and a second held portion held by the holding member, a heat transferring portion transferring heat to the cooling member in contact, a first spring portion pressing the heat transferring portion against the cooling member with spring force generated between the first held portion and the heat transferring portion, and a second spring portion pressing the heat transferring portion against the cooling member with spring force generated between the second held portion and the heat transferring portion. The pressing structure is configured by the first held portion, the second held portion, the heat transferring portion, the first spring portion, and the second spring portion.