Two-Phase Immersion Cooling With Vacuum Pressure Control
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Solution Overview
Problem
Traditional computing systems face inefficiencies in cooling and space utilization due to the use of air cooling, while liquid cooling systems often require constant fluid replenishment and are prone to contamination, leading to performance degradation and potential component damage.
Innovation Solution
A pressure-controlled vessel system using dielectric fluid for immersion cooling, which maintains a vacuum to reduce boiling point, incorporates condensing structures for vapor management, and employs a robust fluid management system to conserve and purify the dielectric fluid, ensuring efficient and continuous cooling without exposing components to gaseous phases.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If air cooling is used, then system simplicity is maintained, but cooling efficiency is insufficient and space utilization is poor
Solution Approach 1:
The patent transitions from air cooling to liquid immersion cooling by submerging computer components directly in dielectric fluid. This hydraulic approach allows direct heat transfer from components to the liquid coolant, dramatically improving cooling efficiency while the closed-loop system manages complexity through standardized fluid management infrastructure
2Productivity
If traditional liquid cooling is used, then cooling efficiency improves, but fluid contamination and performance degradation occur
Solution Approach 1:
The patent uses dielectric fluid that creates an electrically inert environment, preventing conductive contamination and electrical shorts. The fluid's inherent dielectric properties protect components while the closed-loop system prevents external contamination, maintaining both cooling efficiency and electrical safety over extended operational periods
Solution Approach 2:
The closed-loop fluid management system continuously circulates and filters the dielectric liquid, recovering and reusing the coolant rather than allowing it to be discarded. This approach maintains fluid purity by removing accumulated contaminants while preserving the cooling medium for ongoing operation
3Loss of energy
If dielectric fluid immersion cooling is used, then cooling efficiency and energy savings improve, but vaporization and pressure management become complex
Solution Approach 1:
The patent exploits the phase transition properties of dielectric fluid, allowing it to vaporize at controlled temperatures to absorb heat from components, then condense back to liquid in heat exchangers. This two-phase cooling cycle maximizes heat removal efficiency while the vaporization-condensation process naturally manages pressure through phase equilibrium
Solution Approach 2:
The pressure control system incorporates sensors and actuators that continuously monitor and adjust pressure within the closed-loop system. This feedback mechanism maintains optimal pressure levels by responding to temperature and vaporization rate changes, ensuring stable operation while maximizing the energy efficiency of the phase-change cooling process
4Area of stationary object
If component density is increased, then space utilization improves, but heat generation and cooling demands increase
Solution Approach 1:
The liquid immersion cooling system provides superior heat transfer coefficients compared to air cooling, enabling effective cooling of high-density component arrangements. The direct liquid-to-component contact allows rapid heat removal from tightly packed electronics, maintaining acceptable temperatures even as component density and total heat generation increase
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system achieves enhanced cooling efficiency, reduced energy consumption, and increased component density by maintaining stable temperatures and minimizing fluid loss, while preventing contamination and damage, thus improving overall system performance and reliability.
Implementation Method 1
computer components and other electronics may be submerged in a dielectric or electrically non-conductive liquid in order to draw heat directly from the component into the liquid
Implementation Method 2
a condensing system in order to cool and convert gaseous dielectric fluid to liquid dielectric fluid
Implementation Method 3
The disclosed pressure management system allows the disclosed embodiment to operate under a vacuum, thereby reducing the temperature at which dielectric fluid vaporizes
Data Source
AI summary
A two-phase liquid immersion cooling system is described in which heat generating computer components cause a dielectric fluid in its liquid phase to vaporize. The dielectric vapor is then condensed back into a liquid phase and used to cool the computer components. Heating elements are used to maintain a minimum temperature of a dielectric immersion fluid within a two phase liquid immersion cooled computing system. The added heat from heating elements may facilitate startup by minimizing the amount of vapor load/pressure when starting up the unit and bringing one or more servers on line.