Integrated Chip Cooling Loop With Impingement and Low Pressure Loss
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Solution Overview
Problem
Existing liquid cooling systems for semiconductor chips face issues with heat and pressure losses due to long tubing and connectors, which complicates the system and reduces performance.
Innovation Solution
A cooling device with an integrated heat exchanger and pump, where the cooling fluid flow cycle is fully confined within the device, eliminating the need for external tubing and reservoirs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If external tubing and connectors are used to connect the pump and impingement head, then the system can be assembled from separate components, but heat and pressure losses increase and system complexity increases
Solution Approach 1:
The patent merges the pump, heat exchanger, and impingement head into a single integrated cooling device. The pump and heat exchanger are positioned in close proximity to the impingement head, eliminating the need for long external tubing. This integration maintains component modularity while removing energy losses associated with external connections.
2Ease of manufacture
If external tubing and connectors are used, then the system can be assembled from separate components, but the system becomes more complex and requires reservoirs
Solution Approach 1:
The patent combines multiple cooling system components (pump, heat exchanger, impingement head) into a single integrated unit. This merger eliminates the need for separate reservoirs and external tubing connections, thereby reducing system complexity while maintaining ease of manufacture through modular integration.
3Adaptability or versatility
If long tubing is used between the pump and impingement head, then the system can be flexible in installation, but pressure drop increases and pump performance decreases
Solution Approach 1:
The patent integrates the pump and impingement head into a single device with minimal internal fluid pathways. This integration eliminates long external tubing, thereby reducing pressure drops and maintaining pump performance while still allowing installation flexibility through the overall modular design of the cooling device.
4Adaptability or versatility
If connectors and tubes of different materials are used, then the system can accommodate various cooling liquids, but material compatibility becomes difficult to optimize
Solution Approach 1:
The patent uses uniform material construction for all internal fluid pathways and components in contact with the cooling liquid. This homogeneity eliminates material compatibility issues that arise from using different materials for tubes and connectors, while still allowing selection of cooling liquids compatible with the chosen material.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution reduces heat and pressure losses, simplifies the cooling system, and increases the compatibility of cooling fluids with materials used in the system.
Implementation Method 1
enabling a cooling fluid in the liquid state to impinge on the surface of the electronic component
Implementation Method 2
a heat exchanger including one or more heat exchange channels configured so that the flow cycle further includes the flow of the cooling fluid through the one or more heat exchange channels
Implementation Method 3
one or more refrigerant channels configured to allow the passage of a refrigerant so as to enable a heat exchange between the refrigerant and the cooling fluid
Implementation Method 4
a pump configured to cyclically drive the flow of the cooling fluid in a flow cycle that is confined within the device
Data Source
AI summary
A cooling device configured to be mounted in close proximity to an electronic component that is to be cooled is provided. In one aspect, the device includes impingement channels and return channels for guiding a flow of cooling fluid towards and away from a cooled surface of the electronic component. The device also includes a heat exchanger and a pump, so that the flow cycle of a cooling fluid is fully confined within the device itself. The impingement channels, the return channels, and the heat exchanger are integrated in a common housing, which includes an inlet opening and an outlet opening for coupling the device to a refrigerant loop. The pump may be a micropump mounted directly on the housing and coupled to the inlet and outlet openings in the housing. A cooling system including the device and the refrigerant loop is also provided.