Stacked Water-Cooling Plate for Uniform Heat Exchange
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Solution Overview
Problem
Existing water-cooling plates suffer from uneven heat exchange efficiencies due to the arrangement of inlet and outlet flow channels on a single plane, occupying large spaces, and lack flexibility in connecting multiple modules effectively.
Innovation Solution
A modular water-cooling plate design featuring stacked chambers with non-straight flow channels and varying heat exchanging surfaces, allowing for efficient heat exchange and compact structure with modular connectivity options.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If inlet and outlet flow channels are disposed together on a single plane, then the structure is simple, but heat exchange efficiency becomes uneven between upstream and downstream
Solution Approach 1:
The patent transitions from a single-plane channel arrangement to a three-dimensional stacked chamber configuration. The flow channels are distributed across multiple planes and levels, with inlet channels at upstream levels and outlet channels at downstream levels, creating a multi-dimensional flow path that balances heat exchange efficiency throughout the module while maintaining structural simplicity through standardized stacking.
2Area of stationary object
If a conventional heat dissipation module occupies large space, then heat exchange area is sufficient, but multiple modules cannot be effectively connected and replaced
Solution Approach 1:
The heat dissipation system is divided into multiple independent modular units, each containing complete flow channels and heat exchange surfaces. These standardized modules can be individually connected, disconnected, and replaced without affecting other modules, enabling flexible system configuration and maintenance while collectively providing sufficient total heat exchange area.
Solution Approach 2:
Multiple heat dissipation modules are stacked and connected in a compact three-dimensional arrangement, with modules nested or positioned adjacent to each other. This vertical stacking approach maximizes the utilization of space, providing large total heat exchange area while keeping the footprint compact and enabling easy connection and replacement of individual modules.
3Device complexity
If flow channels are arranged in a straight path, then fluid flow is simple, but heat exchange period is insufficient
Solution Approach 1:
The flow channels within each chamber are designed with curved or serpentine paths rather than straight lines. The channels wind through the heat exchange surfaces in a meandering pattern, increasing the residence time of the fluid and extending the heat exchange period. This curved path arrangement maintains relatively simple flow dynamics while significantly enhancing heat transfer effectiveness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances heat dissipation efficiency per unit volume, reduces pressure drop, and allows for flexible module connection and replacement, optimizing heat exchange performance across different dimensions and shapes.
Implementation Method 1
The first heat exchanging plate has a first fin structure protruding from a side thereof. The second heat exchanging plate has a second fin structure protruding from a side thereof.
Implementation Method 2
A fluid is circulated in a flow channel defined in the closed chamber, and the heat generated by the chip is remover by the fluid.
Implementation Method 3
The first communication port, the first channel, the communication opening, the second channel and the second communication port are connected sequentially in a series.
Data Source
AI summary
This disclosure is directed to a water-cooling plate having a first heat exchanging plate, a second heat exchanging plate and a main body. The first heat exchanging plate has a first fin structure. The second heat exchanging plate has a second fin structure. The main body has a partition plate, a first communication port and a second communication port, the main body has a first recess and a second recess, disposed at two sides of the partition plate. The partition plate has a communication opening communicated to the first recess and the second recess. The first fin structure is accommodated in the first recess to define a first channel, and the second fin structure is accommodated in the second recess to define a second channel. The first communication port, the first channel, the communication opening, the second channel, the second communication port are connected with each other sequentially.