Fiber Thermal Contact Assembly for Vibration-Resistant Heat Transfer
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Solution Overview
Problem
Existing heat transfer devices are sensitive to vibrations and movements, making them unsuitable for use in systems that require efficient heat elimination from heat-generating devices experiencing mechanical stress or dynamic conditions.
Innovation Solution
A thermal contact apparatus comprising interweaved fiber-bundles connected to plates, allowing for efficient heat transfer without a rigid mechanical interface, which provides flexibility and resistance to vibrations, using materials like copper fibers and aluminum plates with cavities for improved thermal conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a rigid mechanical interface is used for heat transfer, then thermal contact efficiency is improved, but sensitivity to vibrations and movements increases
Solution Approach 1:
The patent uses flexible fiber bundles instead of rigid mechanical interfaces to transfer heat. These fibers can deform and absorb vibrations while maintaining thermal contact, thus improving reliability under vibrational conditions without sacrificing thermal efficiency
Solution Approach 2:
The invention replaces the traditional rigid mechanical contact system with a fiber-optic-based thermal transfer system. The fibers transmit heat through thermal conduction while their flexible nature allows them to withstand vibrations and movements that would damage rigid mechanical interfaces
2Reliability
If tight tolerances and mechanical adjustments are used for heat transfer, then thermal resistance is reduced, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The patent replaces complex mechanical adjustment systems with simple fiber bundle connections. The fibers are inserted into corresponding cavities without requiring precise mechanical alignment or adjustment, significantly reducing device complexity while maintaining effective heat transfer
Solution Approach 2:
The invention changes the thermal transfer mechanism from requiring precise mechanical contact parameters (tight tolerances, mounting constraints) to utilizing thermal conduction through fiber materials. This parameter change allows for higher manufacturing tolerances and simpler assembly processes
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus achieves efficient heat transfer with high thermal conductivity and flexibility, capable of withstanding vibrations and movements, ensuring effective heat elimination from heat-generating devices while minimizing mechanical stress on components.
Implementation Method 1
a first set of fibers, suitable to absorb heat from said first plate and transfer the heat to other components of the apparatus
Implementation Method 2
a second set of fibers, suitable to absorb heat from said first set of fibers and thansfer the heat to other components of the apparatus
Data Source
AI summary
The invention relates to a thermal contact apparatus, comprising: a first plate, suitable to be connected to a heat source, absorb heat from said heat source, and transfer the heat to other components of the apparatus; a first set of fibers, suitable to absorb heat from said first plate and transfer the heat to other components of the apparatus, wherein said first set of fibers is connected to said first plate; a second set of fibers, suitable to absorb heat from said first set of fibers and thansfer the heat to other components of the apparatus, wherein said first and second sets of fibers are in contact; and a second plate, suitable to absorb heat from said second set of fibers and transfer the heat out of the apparatus, wherein said second set of fibers is connected to said second plate.