Imaging Housing Airflow Layout for Multi-Surface Heat Dissipation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing imaging devices in vehicles and mobile bodies face challenges in efficiently dissipating heat, particularly when ventilation fans are used for air exchange.
Innovation Solution
The imaging device incorporates a housing with multiple heat-dissipating surfaces and a fan configuration that blows air onto multiple surfaces, including a fan cover to direct airflow effectively, and includes fins and a guide plate to enhance heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a ventilation fan is used to exchange air in the imaging device, then heat dissipation is improved, but airflow that does not contribute to heat dissipation is generated
Solution Approach 1:
The housing is designed with differentiated surface characteristics where the first surface has a first area for heat dissipation and the second surface has a second area with different properties. This local differentiation allows optimized airflow distribution - directing effective cooling airflow to the first surface while managing airflow on the second surface to minimize energy waste from ineffective circulation.
Solution Approach 2:
The invention utilizes multiple spatial dimensions by defining distinct first and second surfaces on the housing with different orientations and functions. The first surface faces a first direction for primary heat dissipation, while the second surface faces a second direction for secondary heat dissipation or airflow management, creating a three-dimensional heat dissipation strategy that maximizes effective airflow utilization.
2Temperature
If air is blown on multiple surfaces of the housing, then heat dissipation is improved, but device complexity increases
Solution Approach 1:
The housing serves multiple functions simultaneously: it provides structural support, defines the device envelope, and acts as a heat dissipation surface through its first and second surfaces. The fan also performs dual functions by both generating airflow for cooling and directing it to specific surfaces. This multi-functionality reduces the need for separate dedicated cooling components, thereby limiting complexity increase.
Solution Approach 2:
The invention merges the heat dissipation function directly into the housing structure itself, making the housing walls (first and second surfaces) the heat dissipation surfaces. This eliminates the need for separate heat sinks or cooling plates in many cases, combining structural and thermal management functions into a single integrated component.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves heat dissipation by allowing heat to be transferred and dissipated in multiple directions, reducing airflow that does not contribute to heat dissipation, and utilizing air from the vehicle's defroster for enhanced cooling.
Implementation Method 1
a fan configured to blow air on at least a portion of the first surface and at least a portion of the second surface
Implementation Method 2
the housing surrounding the circuit board and holding the circuit board in a heat-transferable manner
Data Source
AI summary
An imaging device includes an imaging optical system, an imaging element, a circuit board, a housing, and a fan. The imaging element is located on an optical axis of the imaging optical system. The circuit board processes an image signal outputted by the imaging element. The housing has at least a first surface and a second surface. The first surface is on a first direction side. The first direction is parallel to the optical axis of the imaging optical system and faces an object. The second surface is on a second direction side. The second direction is perpendicular to the first direction and faces vertically upward. The housing surrounds the circuit board. The housing holds the circuit board in a heat-transferable manner. The fan blows air on at least a portion of the first surface and at least a portion of the second surface.