Graphene-Copper Sandwich Heat Spreader for High Heat Flux Cooling
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Solution Overview
Problem
The increasing heat flux density and thermal management requirements in electronic products due to miniaturization and high functionality demand more effective heat dissipation solutions, particularly for components like CPUs and GPUs, to ensure reliability and extend service life.
Innovation Solution
A heat management structure comprising a 'sandwich' configuration of a copper foil layer, a graphene layer, and an electroplating copper layer, formed through an electrochemical process involving delamination and electrodeposition, to enhance thermal conductivity and reduce cooling time.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional metal heat conduction materials (copper, aluminum) are used, then heat management is effective, but thermal conductivity and heat management efficiency are insufficient for high heat flux density applications
Solution Approach 1:
The patent applies composite materials by combining graphene layers with copper foil to create a hybrid heat management structure. The graphene-copper composite leverages the high thermal conductivity of copper (385 W/m·K) and the exceptional thermal conductivity of graphene (up to 5300 W/m·K), achieving superior heat dissipation performance that neither material could accomplish alone. This composite structure directly resolves the contradiction by providing both effectiveness and high thermal conductivity for high heat flux density applications.
2Reliability
If graphene is used to replace conventional metal heat conduction materials, then thermal conductivity and heat management effect are improved, but manufacturing complexity increases
Solution Approach 1:
The patent applies segmentation by dividing the heat management structure into distinct functional layers: graphene layers (providing high thermal conductivity and heat distribution) and copper foil layers (providing bulk heat conduction and structural support). This segmented approach simplifies manufacturing by allowing each layer to be optimized and processed separately, then assembled into the final composite structure, thereby reducing overall manufacturing complexity while maintaining high thermal conductivity.
Solution Approach 2:
The patent applies multi-functionality by designing the graphene-copper composite structure to simultaneously achieve multiple functions: heat conduction, heat distribution, structural integrity, and electrical conductivity. The graphene layers provide high thermal conductivity and heat distribution across the surface, while the copper foil provides bulk heat conduction and mechanical support. This multi-functional design reduces the need for additional components, simplifying the overall manufacturing process.
3Temperature
If artificial graphene is used with thickness lower than 0.01 mm to achieve high thermal conductivity, then heat management efficiency is improved, but cost increases significantly
Solution Approach 1:
The patent applies merging by combining multiple thinner graphene layers with copper foil into a single composite heat management structure. Instead of using one expensive ultra-thin artificial graphene layer, the patent merges several standard-thickness graphene layers with copper foil, achieving comparable or superior thermal conductivity through the synergistic effect of the composite structure while significantly reducing the cost of graphene material.
4Productivity
If heat management structures are added to electronic products, then heat dissipation is improved, but device size and weight increase
Solution Approach 1:
The patent applies thin films by using graphene layers with thickness of micrometers or less, combined with thin copper foil, to create an ultra-thin heat management structure. This thin-film composite provides high heat dissipation capability while adding minimal weight and thickness to the electronic product, directly resolving the contradiction between heat dissipation performance and device weight.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The structure achieves rapid heat dissipation, with temperature drop to room temperature in a few seconds, outperforming traditional methods by effectively managing heat flux and ensuring quick cooling.
Implementation Method 1
forming a graphene layer on the copper foil layer surface
Implementation Method 2
formed through an electrochemical process involving delamination and electrodeposition
Implementation Method 3
forming an electroplating copper layer on the graphene layer surface
Implementation Method 4
the graphene radiator can be used with other heat management modules to achieve higher heat management effects. The main reason that graphene can achieve higher a heat management effect is because of its hexagonal mesh plane structure, which can quickly and effectively distribute the heat energy in a two-dimensional plane
Implementation Method 5
conventional heat management materials such as copper, and aluminum etc. have been widely used in the heat management field
Data Source
AI summary
The invention relates to a heat management structure with graphene and copper, and a formation method thereof, comprising a copper foil layer provided, then forming a graphene layer on the copper foil layer surface, and forming an electroplating copper layer on the graphene layer surface, and eventually forming an electroplating copper layer-graphene layer-copper foil layer sandwich heat management structure.