Semiconductor Cooling Layout for Central Hotspot Heat Removal
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Solution Overview
Problem
Existing cooling devices for semiconductor components exhibit insufficient cooling effects in the central portion due to superimposed heat generation, leading to higher temperatures and potential thermal damage.
Innovation Solution
A cooling device design with a refrigerant flow path that includes an introduction port in the central portion of the substrate, featuring a smaller cross-sectional area than the sides, and optionally using fins or pins as cooling bodies, to prioritize cooling of the central component and enhance refrigerant flow velocity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If cooling water flows sequentially from one end of the cooling water passage in the lateral direction, then the semiconductor modules can be cooled in sequence, but the cooling effect in the central portion is insufficient due to superimposed heat generation
Solution Approach 1:
Instead of introducing cooling water from the lateral direction (conventional approach), the patent introduces refrigerant from the central portion of the bottom plate upward through the flow path. This inverted flow direction ensures that the cooling medium first contacts the central semiconductor component where heat generation is superimposed, thereby improving cooling effectiveness in the hottest region.
Solution Approach 2:
The patent creates a localized cooling strategy by forming an introduction port specifically in the central portion of the bottom plate with a smaller cross-sectional area. This local modification concentrates cooling resources where they are most needed (central region with superimposed heat generation) while allowing different flow characteristics in different regions of the flow path.
2Speed
If the flow path cross sectional area at the introduction port is made smaller than on both sides, then refrigerant flow velocity is enhanced and central cooling is prioritized, but manufacturing precision requirements increase
Solution Approach 1:
The patent modifies the cross-sectional area parameter of the flow path by creating a smaller introduction port area in the central region compared to the side regions. This parameter change increases refrigerant flow velocity at the introduction port, enhancing cooling efficiency in the central portion where heat generation is superimposed.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design achieves improved cooling efficiency by preferentially cooling the central semiconductor component, reducing temperature differences and preventing thermal runaway, while simplifying manufacturing and reducing costs.
Implementation Method 1
a cooling device that cools a plurality of semiconductor components, which are mounted on a front surface of a substrate
Implementation Method 2
a flow path through which a refrigerant flows between the bottom plate and the base
Implementation Method 3
a flow path cross sectional area of the flow path at the introduction port is smaller than flow path cross sectional areas on both sides of the flow path in the first direction
Data Source
AI summary
A cooling device of the present disclosure is a cooling device that cools a plurality of semiconductor components, which are mounted on a front surface of a substrate and are arranged in a first direction, the cooling device including a base attached to a rear surface of the substrate, a bottom plate disposed apart from the base to form a flow path through which a refrigerant flows between the bottom plate and the base, and a cooling body disposed in the flow path, in which an introduction port, through which the refrigerant is guided into the flow path from a direction facing the rear surface, is formed in a central portion of the bottom plate in the first direction, and a flow path cross sectional area of the flow path at the introduction port is smaller than the flow path cross sectional areas on both sides of the flow path in the first direction.