Plug-In Module Thermal Interface for Uneven Heat Sink Contact

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Solution Overview

Problem

Existing heat dissipation technologies for electrical components in vehicles face challenges in achieving efficient heat transfer due to unevenness and tolerance issues between heat-dissipating devices and external heat sinks, leading to reduced service life and increased production costs.

Innovation Solution

A plug-in module with an external thermal interface featuring a thermally conductive elastic compensating element and a slidable contact element that compresses to form a thermal contact surface with the heat sink, allowing for improved heat transfer and accommodating surface unevenness without creating a permanent air gap.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If rigid thermal interface components are used between heat-dissipating device and external heat sink, then manufacturing precision can be improved, but surface unevenness and tolerance issues cause poor heat transfer

Engineering Contradiction:
Improvecontact surface flatnessVSAvoidheat transfer efficiency
Core Design Contradiction:
Manufacturing precisionVSReliability

Solution Approach 1:

The patent changes the physical state and mechanical properties of the thermal interface material from rigid to elastic/compliant. The elastic thermal interface material can deform to conform to surface unevenness, maintaining intimate contact between the heat-dissipating device and external heat sink, thereby achieving reliable heat transfer despite manufacturing tolerances and surface irregularities.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent employs a composite thermal interface solution combining elastic material properties with high thermal conductivity. This composite material integrates the compliance needed to accommodate surface variations with the thermal performance required for efficient heat dissipation, resolving the contradiction between manufacturing precision requirements and heat transfer reliability.

Inventive Principle:
Principle #40Composite materials

2Power

If larger contact area is used between heat-dissipating device and external heat sink, then heat dissipation capacity is improved, but production costs increase due to tighter tolerance requirements

Engineering Contradiction:
Improveheat dissipation capacityVSAvoidproduction cost
Core Design Contradiction:
PowerVSEase of manufacture

Solution Approach 1:

By changing the mechanical properties of the thermal interface material to be elastic and compliant, the system can achieve effective thermal contact over a larger area without requiring extremely tight manufacturing tolerances. The material deforms to fill gaps and conform to surface variations, enabling larger contact areas that improve heat dissipation capacity while maintaining ease of manufacture and controlling production costs.

Inventive Principle:
Principle #35Parameter changes

3Reliability

If tight tolerances are applied to contact surfaces, then heat transfer efficiency is improved, but production costs increase

Engineering Contradiction:
Improveheat transfer efficiencyVSAvoidproduction cost
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The patent resolves this contradiction by changing the mechanical properties of the thermal interface material from rigid to elastic. This compliant material can accommodate larger tolerance ranges in the contact surfaces while maintaining intimate thermal contact, thereby achieving reliable heat transfer efficiency without the need for costly tight tolerance manufacturing.

Inventive Principle:
Principle #35Parameter changes

4Reliability

If thermally conductive material is used to compensate for surface unevenness, then heat transfer is improved, but the material may remain on the heat sink surface after removal

Engineering Contradiction:
Improveheat transfer efficiencyVSAvoidremoval cleanliness
Core Design Contradiction:
ReliabilityVSEase of operation

Solution Approach 1:

The patent employs a thin film or sheet-like elastic thermal interface material that can be easily removed from the heat sink surface. The flexible nature of this material allows it to conform to surface unevenness for effective heat transfer during operation, while its thin film structure enables clean removal without leaving significant residue on the heat sink surface.

Inventive Principle:
Principle #30Flexible shells and thin films

Solution Approach 2:

By carefully selecting and controlling the physical parameters of the elastic thermal interface material (such as viscosity, tackiness, and elasticity), the patent achieves optimal balance between heat transfer performance during operation and ease of clean removal afterward. The material parameters are tuned to provide sufficient adhesion for thermal contact while allowing clean detachment.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution enhances heat dissipation capacity, extends the service life of electrical components, reduces production costs, and allows for broader tolerances in contact surfaces, enabling efficient heat transfer even with uneven surfaces and particles.

Implementation Method 1

at least one thermally conductive elastic compensating element, which is connected to the at least one heat-dissipating device and is designed to be compressed during the formation of the corresponding external thermal interface

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

at least one thermally conductive elastic compensating element... designed to be compressed during the formation of the corresponding external thermal interface

Methodology Applied
Scientific EffectElasticity: Elasticity

Implementation Method 3

at least one thermally conductive slidable contact element... designed to form a thermal contact surface of the external thermal interface to the external heat sink

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS20240147674A1Plug-in module and module assembly
Publication Date: 2024.05.02 ROBERT BOSCH GMBH
  • US20240147674A1 patent drawing
  • US20240147674A1 patent drawing
  • US20240147674A1 patent drawing

AI summary

A plug-in module. The plug-in module includes a module housing, a heat-dissipating device, and an electrical component arranged on a printed circuit board. The heat-dissipating device has, on a surface facing the electrical component, an internal thermal interface to thermally couple the electrical component to the heat-dissipating device. The heat-dissipating device has, on a surface facing away from the electrical component, an external thermal interface to thermally couple at least one heat-dissipating device to an external heat sink. The external thermal interface includes a thermally conductive elastic compensating element connected to the heat-dissipating device and designed to be compressed during formation of the external thermal interface. The plug-in module also includes a thermally conductive slidable contact element applied to the thermally conductive elastic compensating element to form a thermal contact surface of the external thermal interface to the external heat sink and compress the thermally conductive elastic compensating element.