Elastic Pressure Block Heat Sink Mounting for Electronic Components

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Solution Overview

Problem

Existing heat dissipation devices for electronic components in vehicles often cause damage due to direct application of rigid forces and require complex processing, which complicates thermal management and reliability.

Innovation Solution

A heat dissipation device comprising a heat dissipation component and a pressing component with a pressure plate and pressure blocks made of elastic materials like plastic or rubber, which apply force to the electronic component indirectly, ensuring good thermal contact without damaging the component.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If rigid pressing structures are used to ensure thermal contact, then thermal contact is improved, but the electronic component may be damaged

Engineering Contradiction:

Improvethermal contact reliabilityVSAvoidcomponent damage

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent introduces a pressing component made of elastic material (rubber or plastic) as an intermediary between the heat dissipation component and the electronic component. This elastic pressing component transmits the pressing force while accommodating variations in component dimensions and preventing direct rigid contact that could damage the electronic component, thus resolving the contradiction between ensuring thermal contact and preventing damage.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Reliability

If complex processing is used to ensure thermal contact, then thermal management is improved, but manufacturing complexity increases

Engineering Contradiction:

Improvethermal managementVSAvoidprocessing complexity

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The patent changes the material parameter of the pressing component from rigid to elastic (using rubber or plastic materials), which allows the component to deform and adapt to dimensional variations in the electronic component. This material parameter change simplifies the manufacturing process by eliminating the need for complex precision machining while maintaining effective thermal contact.

Inventive Principle:

Principle #35Parameter changes

3Ease of manufacture

If elastic materials are used for pressing component, then ease of manufacture is improved, but electrical insulation may be compromised

Engineering Contradiction:

Improvemanufacturing simplicityVSAvoidelectrical insulation

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

The patent specifies that the pressing component should be made of elastic insulating material, combining the properties of elasticity (for accommodation and pressing) and electrical insulation (for safety). This composite material selection resolves the contradiction by providing both ease of manufacture through material flexibility and reliable electrical insulation.

Inventive Principle:

Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution provides effective thermal management by preventing damage to electronic components, simplifying manufacturing and disassembly, and enhancing electrical insulation, while maintaining reliable thermal contact.

Implementation Method 1

the pressure block comprises a first member, and a free end of the first member is able to pass through the through hole and press against a first side of the pressure plate... material of the pressure block comprises plastic or rubber

Methodology Applied

Scientific EffectElasticity: Elasticity

Implementation Method 2

heat needs to be rapidly released to the surroundings by means of a heat dissipation device, to lower the operating temperature of the electronic component

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentEP4496443A1Heat dissipation device for electronic component, electrical converter and vehicle

Publication Date: 2025.01.22 VALEO ELECTRIFICATION

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AI summary

The present disclosure relates to a heat dissipation device for an electronic component. The heat dissipation device includes: a heat dissipation component arranged at a first side of the electronic component; and a pressing component arranged at a second side of the electronic component opposite the first side, wherein the pressing component includes a pressure plate and a pressure block, and the pressure block passes through the pressure plate and contacts the electronic component, and the pressure plate is connected to a fixed structure to apply a force towards the heat dissipation component to the electronic component via the pressure block. The present disclosure also relates to an electrical converter including the heat dissipation device, and a vehicle including the electrical converter.