Semiconductor Module Holder With Snap Mounting for EV Power Electronics
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Solution Overview
Problem
Existing power electronics units for electric vehicle drives face challenges in achieving compactness, ease of assembly, vibration resistance, and compliance with insulation requirements while ensuring secure mounting and efficient cooling.
Innovation Solution
A power electronics unit with a plate-shaped heat sink and a plastic module holder secured by a positive-locking snap connection, featuring form-locking elements and separate locking elements, allows for easy assembly and robust attachment of semiconductor modules.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If friction-fit fasteners are used to fix the power semiconductors to the heat sink, then the mounting is simple, but the static seals are subjected to relatively high axial compression
Solution Approach 1:
The patent introduces a module holder as an intermediary component between the semiconductor module and the heat sink. This holder distributes the mounting forces and provides a positive-locking snap connection mechanism, eliminating the need for high axial compression on seals while maintaining secure fixation.
Solution Approach 2:
The patent replaces the friction-fit mechanical system with a positive-locking snap connection system. This substitution eliminates reliance on axial compression and friction, providing secure mounting through geometric interlocking instead.
2Device complexity
If clamping blocks are used to press power semiconductors against the cooling plate, then screw holes are eliminated, but the clamping blocks require separate screwing operations
Solution Approach 1:
The patent merges the clamping function and the fastening function into a single integrated module holder component. The snap connection elements are formed as one piece with the holder, eliminating the need for separate clamping blocks and screw operations, thus simplifying both design and assembly.
Solution Approach 2:
The module holder incorporates self-contained snap connection elements that perform both clamping and fastening functions simultaneously. The single-piece design with integrated locking elements enables self-sufficient mounting without requiring separate fastening operations.
3Power
If a compact power electronics design is pursued, then the specific power output increases, but the insulation requirements become more difficult to meet
Solution Approach 1:
The patent utilizes the third dimension (vertical spacing) to maintain insulation distances. By providing sufficient spacing between the semiconductor module, module holder, and heat sink in the vertical direction, the design accommodates insulation requirements while maintaining a compact horizontal footprint, thus preserving high specific power output.
Data Source
Figure 1~2
Figure 3~5
Figure 6~8
AI summary
The invention relates to a power electronics unit (1) for an electric motor of a motor vehicle drive, having a plate-like cooling element (2), at least one semiconductor module (3a, 3b, 3c) and a module holder (4) which consists of plastic and secures the at least one semiconductor module (3a, 3b, 3c) relative to the cooling element (2), wherein the module holder (4) is fixed to the cooling element (2) via an interlocking snap connection (5).