AC-Driven LED Packaging With Integrated Rectifier Circuit
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Solution Overview
Problem
Existing LED packaging structures require conversion of alternating current (AC) to direct current (DC) for operation, limiting their applicability and efficiency, and are prone to external power supply issues.
Innovation Solution
An LED packaging structure with integrated rectifier chips and a voltage reduction resistor, allowing direct operation with AC or DC power, and featuring a thermal conductive bracket with diamond and ceramic powder for enhanced heat dissipation, using a mixed packaging adhesive for stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If traditional LED packaging structures are used with external power supplies, then the LED can operate with AC or DC power, but the device complexity increases and reliability decreases due to external power supply dependencies
Solution Approach 1:
The patent integrates the power supply circuit directly into the LED packaging structure by mounting rectifier chips, voltage reduction resistors, and capacitors on the same bracket as the LED chips. This merging of power supply and LED components into a single integrated unit eliminates the need for separate external power supplies, thereby reducing device complexity while maintaining power supply compatibility
Solution Approach 2:
The integrated packaging structure serves multiple functions simultaneously: it provides mechanical support for LED chips, integrates power supply circuitry for AC/DC compatibility, and enables direct mounting on power lines. This multi-functionality allows the same structure to handle both lighting and power conversion tasks, improving adaptability without adding external components
2Temperature
If metal brackets are used for heat dissipation, then thermal conductivity improves, but manufacturing complexity increases
Solution Approach 1:
The patent employs a metal bracket that serves as both a structural support and a heat dissipation component. The metal material provides high thermal conductivity for efficient heat transfer from LED chips, while the bracket's simple geometric form maintains ease of manufacturing through conventional metal forming processes
3Adaptability or versatility
If integrated circuits are added to the LED packaging, then the ability to directly use AC power improves, but the device complexity increases
Solution Approach 1:
The patent combines the power supply circuit components (rectifier chips, voltage reduction resistors, capacitors) with the LED mounting bracket into a single integrated structure. This merging reduces the overall device complexity by eliminating separate power supply housings and connections while enabling direct AC/DC power usage
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient operation with AC or DC power, reduces the reliance on external power supplies, and improves heat dissipation and thermal conductivity, thus enhancing the reliability and cost-effectiveness of LED filaments.
Implementation Method 1
a thermal conductive bracket with diamond and ceramic powder for enhanced heat dissipation
Data Source
AI summary
The present disclosure discloses a light-emitting diode (LED) packaging structure, including a bracket, wherein at least two rectifier chips are mounted on the bracket; an internal circuit and a voltage reduction resistor are mounted on the bracket; at least one light-emitting chip is also mounted on the bracket; the light-emitting chip is connected in parallel or series with the rectifier chips through metal wires to form an internal rectifier circuit; and the internal rectifier circuit is formed into a complete internal circuit through voltage reduction or current-limiting protection of the voltage reduction resistor. The LED packaging structure of the present disclosure can make an LED to emit light when driven directly by alternating current power, so that the LED packaging structure can be better used in fields such as product assembling, product application, and product cost, and more resources can be saved.